Industry News | 2014-01-30 19:32:01.0
Gen3 Systems Limited today announced that it will exhibit at Southern Manufacturing 2014 on stand K38. Southern Manufacturing is scheduled to take place on February 12-13, 2014 at FIVE in Farnborough, Hampshire.
Industry News | 2011-07-13 18:24:32.0
The premier model in Manncorp’s line of surface mount rework systems, the BR810 is designed for safe removal, precise placement, and reliable soldering of the most delicate and sensitive SMD packages found in the industry’s most challenging board repair applications.
Industry News | 2012-03-24 10:06:28.0
NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia
Industry News | 2011-08-01 16:38:05.0
Taking place from August 30 to September 1 at the Shenzhen Convention & Exhibition Center, NEPCON South China 2011 will span nearly 30,000 sqm and attract more than 500 exhibitors from 22 countries and regions.
Electronics Forum | Fri Dec 27 10:04:56 EST 2002 | haran
Big pad located at the middle of the package. On the PCB,we need to have solder paste printed on the thermal pad which is at the middle and the other pads of the perimeter BGA.
Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef
Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta
Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto
If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal
Electronics Forum | Sat May 30 01:31:49 EDT 2009 | mika
make 4 square rounded corner apertures on the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. Don't worry to much of the void's. Just following my tips and you will be fine. The
Electronics Forum | Wed Jun 03 13:56:09 EDT 2009 | mika
less total area of voids, which mean a much more strength in the joint and much easier to solder such a cooling pad grounded via vias, with this approach! The same goes for big cooling pads of let say Power transistors without any via etc. Always re
Electronics Forum | Mon Dec 16 10:31:21 EST 2002 | davef
Grant, On those 'dry pads', where does the solder paste end-up after soldering? On: * Pads * Component leads * Someplace else [Where?]
