Electronics Forum | Tue Feb 20 09:46:17 EST 2007 | kmeline
Thanks for the info. I will inform the QA department about the lack of a toe fillet. I am sure it will be an issue.
Electronics Forum | Mon Mar 19 11:20:10 EDT 2007 | realchunks
When you say "No wetting" you mean the paste looks the same as it did going in but dried out? Or is it that you are not getting toe fillets?
Electronics Forum | Tue Mar 20 17:53:44 EDT 2007 | diesel_1t
is not getting toe fillet, you can se like a "paste dome" on the pad so the paste is not flowing to the pin...
Electronics Forum | Thu Mar 22 17:31:08 EST 2001 | davef
Hold off on the sharp knife for little bit. [Yano, I get "queasy" when I see much of my blood, but other people�s blood doesn�t bother me much. Weird, eh?] [Oh bye-da-bye, I didn�t win the bar bet on "Ground Hog Day". I didn�t loose it either. T
Electronics Forum | Thu Jan 24 04:54:43 EST 2002 | wbu
Well Greg, I don�t know YOUR 0805 Pads but if you look at the recommended pattern for 0805 in IPC-SM-782 you might notice that the Z-dimension is somewhat about the size of your 1206 part length. With that and assuming that you ask if the results wi
Electronics Forum | Tue Feb 11 10:41:30 EST 2020 | dunks
We had this problem at my old job. My understanding (from googling this problem previously) is that the exposed leads on the side of the qfn are not tinned and are not required/designed to have a fillet. Someone correct me if I'm spouting lies.
Electronics Forum | Sun Feb 23 21:19:08 EST 2020 | sssamw
Yes, this is for tin-lead profile. And for the QFN pins which has copper exposed that not required and not possible to have fillet on side surface as in IPC, see 8.3.13, in IPC-A-610-G
Electronics Forum | Tue Feb 11 09:26:57 EST 2020 | astarotf
Hi everyone I have problems welding QFN components in a 10-zone reflux oven, we cannot make a welding fillet that covers the entire QFN pin. Currently we use paste T4 - 63Sn / 37Pb. I enclose the curve of the oven profile. Any help or support on this
Electronics Forum | Mon Jul 16 09:04:00 EDT 2001 | Hussman
No argument here. But I've don't think I've ever seen solder balls on 0402s. Even when they're placed on narrow G dimension pads, where there is little toe fillet, I've never seen a solder ball. But your idea of reversed homeplates would work grea
Electronics Forum | Mon Jan 17 11:23:49 EST 2005 | Brad
Ya Russ is right for Ti Parts they tend to use more pelladium, which requires a bit more heat average temp increase is about 10 degrees C. from 225-235. As far as optimum solder joint I look for fillets on all sides of leads. The back of the lead is
