Full Site - : qfp solder non wetting (Page 6 of 58)

DEK Under-Stencil Cleaning Fabric

DEK Under-Stencil Cleaning Fabric

New Equipment | Cleaning Equipment

DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative

ASM Assembly Systems (DEK)

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Practical Components Supplies NEWLY UPDATED AIM Print Test Board and Kit

Industry News | 2010-04-10 23:59:50.0

LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.

Practical Components, Inc.

More BGA Defect Examples Available Royalty FREE

Industry News | 2017-01-05 04:27:37.0

BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:

ASKbobwillis.com

SHENMAO America to Solve Solder Paste Problems at APEX

Industry News | 2018-01-24 20:47:58.0

SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.

Shenmao Technology Inc.

SHENMAO America to Show New Solder Alloy with High Thermal & Impact Reliability at SMTA Michigan Expo

Industry News | 2018-05-16 19:57:33.0

SHENMAO America today announced plans to exhibit at the SMTA Michigan Expo & Tech Forum, scheduled to take place Tuesday, May 22, 2018 at Laurel Manor in Livonia, MI. Company representatives will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 is designed to lengthen stencil life and eliminate head-in-pillow (HiP) defects, voids, slumping and non-wetting opens.

Shenmao Technology Inc.

Cookson Electronics and Practical Components� Introduce Lead-Free Process Capability Program

Industry News | 2004-06-24 17:35:13.0

New Lead-Free validation kit and service smoothes transition to "green" electronic assembly.

Practical Components, Inc.

FCT Solder Introduces WS170 Non-Hygroscopic Water Soluble Solder Paste

Industry News | 2008-07-30 20:42:23.0

GREELEY, CO � July 30, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, premiers WS170 water soluble solder paste.

FCT ASSEMBLY, INC.

SEHO to Debut AOI Feature for the Selective Soldering Process at the 2012 IPC APEX Expo

Industry News | 2012-01-20 15:02:15.0

SEHO Systems GmbH will highlight the new AOI function for its best-selling selective soldering system – the PowerSelective - in Booth #3521 at the upcoming IPC APEX Expo.

SEHO Systems GmbH

SEHO Systems’ Christian Ott to Discuss Costs of Soldering in Nitrogen Atmospheres at SMTAI

Industry News | 2013-09-16 14:25:35.0

SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled, “Soldering in Nitrogen Atmosphere – Do Quality Aspects Justify the Costs?” at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

SEHO Systems GmbH


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