Machine Vision Product's Supra Spectra System for large board AOI and SPI Inspection
The TR7500QE AOI offers high performance 3D solder and assembly inspection by combining the next generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras. Latest inspection softwa
The TR7700QE AOI offers high performance 3D solder and assembly inspection by combining the next generation 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection. Latest inspection software ensures quick CAD-based programmi
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
The new system delivers high-speed (5,700mm2/sec), high-accuracy (XY positioning of 3µm at 3?), height repeatability (below 2µm at 3?), and scalable resolutions of 7, 12 and 18µm for boards weighing 12kg. http://www.sakiglobal.com/automated-optical-i
Used SMT Equipment | Pick and Place/Feeders
Make: ASM Model: ASM SIPLACE Details:1.Theoretical Speed: The SIPLACE SX2 placement machine has a theoretical speed of up to 100,000 CPH .2.Accuracy: The accuracy of the SIPLACE SX2 is ± 22 μm @ 3σ .3.Arm Configuration: The SX2 is configured with du
Used SMT Equipment | Pick and Place/Feeders
Make: ASM Model: ASM SIPLACE Details:1.Theoretical Speed: The SIPLACE SX2 placement machine has a theoretical speed of up to 100,000 CPH .2.Accuracy: The accuracy of the SIPLACE SX2 is ± 22 μm @ 3σ .3.Arm Configuration: The SX2 is configured with du
Used SMT Equipment | Pick and Place/Feeders
Make: ASM Model: ASM SIPLACE Details:1.Theoretical Speed: The SIPLACE SX2 placement machine has a theoretical speed of up to 100,000 CPH .2.Accuracy: The accuracy of the SIPLACE SX2 is ± 22 μm @ 3σ .3.Arm Configuration: The SX2 is configured with du
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