Industry Directory | Consultant / Service Provider / Training Provider
ENERGY1 Asia align years of real world practical experiences, technical interventions and expertise solution to provide world class trainings for the energy industries and market that drive global economies.
Industry Directory | Manufacturer
Turning critical PCB designs into high-quality PCBAs through years of excellence in innovation & evolution.
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Electronics Forum | Wed Jan 23 14:30:09 EST 2008 | operator
Additionally, I have seen the bad align error from incorrect pickup Z. Quad align can freak out sometimes if it sees something it doesn't like. If all else fails I just reboot and 99% of the time the problem goes away.
Electronics Forum | Wed Jan 23 14:26:52 EST 2008 | operator
I have seen the bad alignment error many times and never had to replace the head for it. It usually has something to do with the laser windows being dirty or cracked. Also it could be your profile settings. Make sure all of these things are perfect b
Used SMT Equipment | Pick and Place/Feeders
Samsung / Quad Corp Quad QSA-30 SMT Pick& Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: C80006 Features: 3 Nozzle Head 1 Gantry Quad align on the fly heads 208V Power Requirement
Used SMT Equipment | Pick and Place/Feeders
Samsung / Quad Corp Quad QSA-30A SMT Pick & Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: C80122 Features: 3 Nozzle Head 1 Gantry Quad align on the fly heads 208V Power Requirement
Industry News | 2012-12-17 19:16:10.0
IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Parts & Supplies | SMT Equipment
SAMSUNG CP33 CP40 QUAD ALIGNER 10-22603 for SMT Pick And Place Machine Specifications: Brand Name SAMSUNG CCD CAMERA Part number 10-22603 Model 10-22603 Ensure Test in machine confirmation Guarantee 1 month usage for machine Samsung CP40
Parts & Supplies | Pick and Place/Feeders
SAMSUNG CP40,CP45 FEEDER CYLINDER Model Number Machine MDA13X29B CP40,CP45 Supply new and used samsung spare parts for smt machine. CP30 servo amplifier(PU0A015EN21P00) CP60-driver SAMSUNG CP DRIVER SAMSUNG CP20(CP40,CP45)X DRIVER J3
Technical Library | 2023-11-14 02:36:41.0
Understanding In-Circuit Testing (ICT) with PCBA ICT Testing Machine In-Circuit Testing, commonly known as ICT, stands as a sophisticated and precise method within electronics manufacturing. It serves to evaluate the functionality and integrity of individual electronic components on a Printed Circuit Board (PCB). The process employs specialized equipment called ICT Testers, meticulously designed to pinpoint defects, shorts, opens, and other potential issues within the PCB assembly. The Crucial Role of PCBA ICT Testing Machine 1. Quality Assurance ICT is pivotal in ensuring the overall quality and reliability of electronic products. Early identification and rectification of defects in the production process help manufacturers avoid costly recalls, rework, and post-production issues. 2. Cost-Efficiency ICT significantly reduces manufacturing costs by identifying defects at an early stage. This results in fewer defective units reaching the end of the production line, minimizing waste and rework. 3. Faster Time-to-Market Manufacturers can expedite the production process with ICT by swiftly identifying and resolving issues. This leads to faster product launches, providing a competitive edge in the market. Unveiling the Functions of PCBA ICT Testing Machine The ICT Tester, the core of the In-Circuit Testing process, conducts a battery of tests on each PCB, including: 1. Continuity Testing Checks for open circuits, ensuring all connections are properly established. 2. Component Verification Verifies the presence and orientation of components, ensuring alignment with the PCB design. 3. Functional Testing Some ICT Testers execute functional tests, assessing electronic components' performance as per specifications. 4. Short Testing Identifies unintended connections or shorts between different components on the PCB. 5. Insulation Testing Checks for isolation between different circuits, ensuring no undesired connections or paths. 6. Programming and Configuration In some cases, ICT Testers are used to program and configure specific components on the PCB. Advantages of PCBA ICT Testing Machine 1. High Precision ICT offers unparalleled accuracy in defect detection, making it crucial in modern electronics manufacturing. 2. Speed and Efficiency ICT Testers enable rapid testing, allowing manufacturers to assess a large number of PCBs in a short time. 3. Customization ICT Tests can be tailored to suit specific PCB requirements, ensuring thorough evaluation of every design aspect. 4. Data Collection ICT Testers gather valuable data for process optimization and quality control. In-Circuit Testing (ICT) is fundamental in electronics manufacturing, safeguarding product quality, reducing costs, and accelerating time-to-market. The ICT Tester, with its precision and efficiency, positions manufacturers at the forefront of the highly competitive electronics industry. Embracing ICT is not just a choice; it's a necessity for manufacturers striving for excellence in their products. I.C.T is a leading manufacturer of full SMT line machines in the electronic manufacturing industry. Discover how we can enhance product quality, boost performance, and reduce costs. Contact us at info@smt11.com for reliable global supply, unparalleled efficiency, and superior technical service.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Quad Placement System at IBE SMT Equipment More details here: http://www.ibesmt.com/Quad_QSV-1_Pick_Place/Flexible_Placers/3413/SMT.aspx
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
Events Calendar | Wed Sep 21 00:00:00 EDT 2022 - Wed Sep 21 00:00:00 EDT 2022 | Pulau Pinang, Malaysia
Penang Expo & Tech Forum
Events Calendar | Wed Sep 20 00:00:00 EDT 2023 - Wed Sep 20 00:00:00 EDT 2023 | Pulau Pinang, Malaysia
Penang Expo & Tech Forum
Career Center | Albany, New York USA | Technical Support
YINCAE Advanced Materials, LLC. is looking for a highly motivated Technical Engineer. The ideal applicant will be self-directed, well organized, articulate, and a team player. The Technical Engineer will work closely with our Enterprise customers to
Career Center | Waterloo, Ontario Canada | Research and Development
POSITION SUMMARY Reporting into the SMT Process Engineering organization, the successful candidate will be aligned with specific new product introductions and will play a pivotal technical role in the design for manufacturability of these products.
Career Center | Colton, California USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
• Strong experience with the installation, training, and repair on a variety of electro-mechanical, pneumatic, PLC, or computer controlled systems. • Strong Knowledge in SMT equipment, Screen Printer, AOI/SPI, Conformal Coat Systems, Reflow oven, X-R
Career Center | Bangalore-85, ka India | Production
As a Sr.Technician involved in production activities like programming, taking care of the production, process, rectifying the process problems, constantly getting in touch with the customers for any quality issues & other production activities, invol
of aligning two fibers and minimize the losses asso
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic959&OB=ASC.html
(CAPAE) BGA (Ball Grid Array) CGA (Column Grid Array) Crystal LGA (Land Grid Array) with Round Lead LGA (Land Grid Array) with Square Lead QFP (Quad Flat Pack) QFP (Quad Flat Pack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smd-shear
Shear testing is the main test performed for SMD due to component design issues. For example, leadless devices cannot be pull tested as there are no leads to pull upwards and as such must be shear tested to prove their effectiveness
