Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
Industry News | 2012-10-29 15:45:34.0
Preview for Aster Technologies, electronica 2012, Hall A1, Booth 352
Industry News | 2002-04-26 09:00:13.0
Licensing Its Echo and Noise Cancellation Technologies
Technical Library | 2023-09-18 14:10:01.0
As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.
Industry News | 2002-07-02 07:41:33.0
Reprint Services Appoints Agent for Ireland and Northern Ireland
Industry News | 2002-11-13 10:46:07.0
Reprint Services Appoints New Distributor for China and Hong Kong
Industry News | 2021-12-26 20:13:58.0
1. Reasons of High Temperature Breakdown 1.1 Environmental Factors Ambient temperature may not be the main cause of high temperature shutdown, but it is often the inducement of compressor high temperature shutdown. Generally, technicians have a design operating environment temperature (30-40 ℃) when designing compressors. When the air compressor is operated under the designed operating environment temperature, its maximum temperature is close to the protection temperature of the air compressor.
Industry News | 2015-01-25 15:25:24.0
Kurtz Ersa North America will exhibit in Booth #2601 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. For the first time, Ersa will display the new Smartflow 2020 selective soldering system and HOTFLOW 3/20 third generation reflow oven.
Industry News | 2013-11-27 15:30:07.0
Martin introduced its new rework Process Shuttle that streamlines flux and solder paste dipping or printing, and pre-positions the smallest surface mountable devices (SMDs) for pickup. This enhancement to the company's EXPERT 10.6 rework system was designed to increase the efficiency and quality of the work performed.
Industry News | 2009-06-23 22:33:15.0
PEMBROKE, Bermuda, June 23 /PRNewswire-FirstCall/ -- Tyco Electronics Ltd. (NYSE: TEL) today announced that at yesterday's Special General Meeting shareholders approved all proposals that are required to change the company's place of incorporation from Bermuda to the canton of Schaffhausen, Switzerland.
