Industry News | 2018-05-13 07:13:17.0
IPC – Association Connecting Electronics Industries® and the Information Technology Industry Council (ITI) will host a conference series on “Critical and Emerging Environmental Product Requirements” this June.
Industry News | 2019-05-05 19:06:43.0
IPC – Association Connecting Electronics Industries® and the Information Technology Industry Council (ITI) will host a conference series on “Critical and Emerging Environmental Product Requirements” in Boston, the Chicago area and San Jose on June 3, 5, and 7, respectively. The series will feature well-known United Kingdom (UK) regulators Carl Magness, product safety enforcement team leader, and Paul Tennant, product safety enforcement manager, both within the UK Office of Business, Energy and Industrial Strategy (BEIS), and Giuseppina Luvara, a policy officer within the European Commission’s Directorate General of Environment.
Industry News | 2023-05-15 17:38:25.0
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.
Industry News | 2018-08-28 17:04:51.0
IPC – Association Connecting Electronics Industries® in partnership with Surface Mount Technology Association (SMTA) will host the High-Reliability Cleaning and Conformal Coating Conference, November 13–15, at the Chicago Marriott in Schaumburg, Ill. The 2018 conference will focus on electronics assembly and the influence of cleanliness and coating on producing reliable hardware.
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | Indianapolis, Indiana USA
Indiana Chapter Technical Presentation and Networking Event: Batteries, Baseball & Beer
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Events Calendar | Fri Jun 07 00:00:00 EDT 2019 - Fri Jun 07 00:00:00 EDT 2019 | San Jose, California USA
ITI and IPC Conference on Emerging & Critical Environmental Product Requirements
Events Calendar | Mon Jun 03 00:00:00 EDT 2019 - Mon Jun 03 00:00:00 EDT 2019 | Boston, Massachusetts USA
ITI and IPC Conference on Emerging & Critical Environmental Product Requirements
Events Calendar | Wed Jun 05 00:00:00 EDT 2019 - Wed Jun 05 00:00:00 EDT 2019 | Chicago, Illinois USA
ITI and IPC Conference on Emerging & Critical Environmental Product Requirements
Events Calendar | Tue Jul 18 00:00:00 EDT 2023 - Tue Jul 18 00:00:00 EDT 2023 | Chippewa Falls, Wisconsin USA
UMW Chapter In-Person Event: PCB 101 Workshop and Tour at TTM Chippewa Falls
