The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
The ZHX-R20B second generation brings a cost effective solution to the market, providing reliable insertion to a wide variety of Radial type components. The ZHX-R20B is a Windows 7 based computer controlled high speed Radial inserter, with insertion
Technical Library | 2020-12-16 18:50:42.0
System operating speeds continue to increase as a function of the consumer demand for such technologies as faster Internet connectivity, video on demand, and mobile communications technology. As a result, new high performance PCB substrates have emerged to address signal integrity issues at higher operating frequencies. These are commonly called low Dk and/or low loss (Df) materials. The published "typical" values found on a product data sheet provide limited information, usually a single construction and resin content, and are derived from a wide range of test methods and test sample configurations. A printed circuit board designer or front end application engineer must be aware that making a design decision based on the limited information found on a product data sheet can lead to errors which can delay a product launch or increase the assembled PCB cost. The purpose of this paper is to highlight critical selection factors that go beyond a typical product data sheet and explain how these factors must be considered when selecting materials for high speed applications
A universal radio test set for complete maintenance and repair of FM and AM radio stations of the VHF band RST-430 is a multipurpose radio measuring device for maintenance of communication equipment in indoor and field conditions. Functions
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
Used SMT Equipment | General Purpose Test & Measurement
Motorola R2600D - Standard Unit for general purpose 2-way testing. If you maintain, repair, calibrate, or design radio communications equipment, the R2600 family of Communications System Analyzers has a solution for you. Rugged enough to withstand h
Career Center | Melbourne, Florida USA | Production
The SMD Repair / Operator performs all hand loading/unloading/operation of SMD line, manual soldering of Through-hole parts, inspection of PCBA's, and rework as required to support SMD production. Responsibilities: - Assists with manually load
Industry Directory | Distributor / Manufacturer
Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.
Industry News | 2001-12-14 15:08:35.0
Avail. for ordering at Dynamic Engineering
Used SMT Equipment | In-Circuit Testers
Anritsu MP1764C The MP1764C is used in combination with the MP1763A Pulse Pattern Generator to detect errors used to evaluate conformity with ITU-T standards. In addition, complicated searching for input thresholds or phase adjustments is simplif
winsouce.jpg)