Industry Directory | Manufacturer
Founded in 1997 by veterans of the audiovisual industry, Aurora Multimedia uses state-of-the-art technologies to define the cutting edge.
New Equipment | Tape and Reel Equipment
Quad 8 mm. tape and reel feeders $50.00 each!
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
Electronics Forum | Wed Jan 23 11:28:47 EST 2008 | tbkonrad
Help! Since last Friday i have been having issues with a Quad qsv-1, it all started with a quad align error, i found there to be a small quantity of grease covering the lenses on both quad align sensors. I wiped the grease off and then everything s
Electronics Forum | Fri Jun 30 09:49:05 EDT 2006 | bobpan
Did they take you into the real time computer and check the display live image ....to actually see if the quad align is good or not???? What types of errors are you getting???? Can you do a machine- calibration- quadalign and get a good reading????
Used SMT Equipment | AOI / Automated Optical Inspection
Operating System: Linux Details: • Inspection envelope 20” x 20” • Large format 5mp Color camera for01005 Inspection • Quad Color lighting • Telecentric, Look Down Optics • High speed precision stage with .05um Linear Encoder • System softwar
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel: ASM X4i Details:1.High Speed: Theoretical speed up to 229,300 Cph, IPC speed of 125,000 Cph, and SIPLACE benchmark evaluation of 150,000 Cph .2.High Precision: Placement accuracy of ±22 μm @ 3σ, and angular accuracy of ±0.5°/3σ .3.La
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2014-06-27 19:17:55.0
ADLINK Technology announced the release of its powerful, new generation x86 smart camera, NEON-1040, featuring the quad core Intel® Atom™ processor E3845 1.9 GHz, 2048 x 2048 pixels @ 60 fps 1" monochrome CMOS global shutter image sensor, and PWM lighting control support.
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
SMTnet Express, March 26, 2020, Subscribers: 35,188, Companies: 10,983, Users: 25,722 New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications Credits: FocalSpec, Inc. This paper introduces line confocal technology
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/about/blog/why-invest-in-inventory-management
. Specially Developed Intelligent Algorithms The Assure™ technology does not use a generic image analysis package modified to fit the task of counting SMD reels
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/library-expert-2017-15-released_topic2188_post9048.html
2017.15 Released!! Posted: 16 Jul 2017 at 11:09am There was Contour Courtyard regression for Quad family packages. This issue was fixed 24 hours after the preliminary release
