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Specializing in Quad/Tyco... Buyer and Seller of Used, New and Re-built Circuit Board Assembly Equipment, Screen Printers, Pick & Place, Reflow Ovens, Spare Parts, Feeders, Dispensing, Depaneling
ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig
22510 PART 22705 PART 10114KX PCB ASSEMBLY 10115BP PCB ASSEMBLY 101-4 RACK CONSOTROL FLUSH MOUNT 4UNIT MOUNTING 111-A INDICTAOR 111-A-L INDICTAOR PNEUMATIC CONSOTROL HIGH-LOW ALARM LIGHT 121003D D ETECTOR 122-FE RECORDER 2PEN PNEUMATIC PROCES
Electronics Forum | Mon Jun 19 08:49:40 EDT 2017 | westshoredesign
Just buy a separate machine to apply paste. You'll be able to run faster, (by doing more at the same time) and you can probably find an air-over-syringe system for less than $2000USD. At the end of the day, that's probably less than you'll spend in t
Electronics Forum | Tue May 31 15:03:31 EDT 2011 | gosswald
The complete model number is QSA-30. Thanks
Industry News | 2014-08-20 13:44:58.0
MIRTEC announces that it will introduce the new economical MV-6E In-Line AOI Series for the first time in booth A-1E45 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
Industry News | 2013-12-05 16:48:11.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it has been selected as a finalist for the 2014 Best in Test Awards in the Machine Vision/Inspection category for its MV-9 2D/3D CoaXPress In-Line AOI Series. Since 1991, the Best in Test Awards have recognized the best in test products and test professionals.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place
Our QSA-30 Pick and Place machines are returned to like new condition by factory trained engineers. These systems are completely rebuilt to include new P4 computers, Hard Drives, Keyboards, Monitors, and a Trackball Mouse. The sheet metal covers are
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
