Career Center | Twinsburg, Ohio USA | Maintenance
We are in need of Universal/Fuji machine operators, Alternative machines to the Universal are listed below. SMT machines (Fuji, Panasonic, Quad, Siemens, Dek, BTU, Electrovert, Heller, Phillips) Location: Twinsburg (Ohio), saburb of Cleveland It is a
Career Center | Fremont, California USA | Production
NRC Manufacturing, is a small, tight knit operation looking for a capable and knowledgeable SMT Machine Programmer. Experience and skill are important to us, and we’re looking for someone that can hit the ground running and knows their way arou
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
The ZHX-R20B second generation brings a cost effective solution to the market, providing reliable insertion to a wide variety of Radial type components. The ZHX-R20B is a Windows 7 based computer controlled high speed Radial inserter, with insertion
For more than 25 years, K&S is an expert in the business areas of Trading, Engineering & Consulting and Training & Analytics
New Equipment | Design Services
PollEx PCB DFE PollEx DFE is rule-based PCB verification software for electrical engineers. It consists of Pre-Processor, Running Core, and Post-Processor. Pre-Processor is used for setting input parameters. Users can define rules or classify and
Overview • Almost 60 times faster than the original 80C51 • Almost 5 times faster than 80C251 - at the same frequency • Quad-Pipelined architecture DQ80251 is a revolutionary Quad-Pipelined ultra high performance, speed optimized soft cor
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
Used SMT Equipment | In-Circuit Testers
Agilent 71612B-UHF Digital Transmission Tester 12Gb/s The 71612B error performance analyzer addresses applications for high speed digital testing up to 12 Gb/s, including R&D and manufacturing test of lightwave components and sub-assemblies, ad
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