Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification / Training Provider
Blackfox is the industry leader in providing IPC Certifications, Solder Training, Customized Training Programs, and Counterfeit Component Training and Certification.
Industry News | 2021-06-15 04:22:53.0
IPCs Connected Factory Exchange (CFX) standard defines communication between processes and devices for Industry 4.0. MIRTEC and Optel Software worked together to develop a CFX based interface between MIRTEC's AOI machines and Optel Software's MES system. The goal was to implement full AOI process control at test it at their mutual customer site, VIRTEX plant in Dallas, TX. The resulting CFX interface is vendor independent and will allow MIRTEC to interface with other MES systems, and Optel Software to interface with other AOI machines, with no changes.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Industry News | 2003-05-21 09:03:19.0
Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs
Industry News | 2015-09-30 16:50:32.0
MIRTEC and YXLON were awarded Best Innovation by SMT Today Magazine for the joint development of the SmartLoop yield improvement system during the recent SMTA International Conference & Exhibition. The award was presented to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division, and Keith Bryant, Sales Director for SmartLoop, on Tuesday, September 29, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The ‘Best Innovation Award’ recognizes clear visionary and transformative technology within the electronics manufacturing industry. This award showcases innovations that have not only addressed a need and solved a problem, but have also been used to drive improved efficiency and productivity of an organization.
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2021-12-21 14:45:26.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
Industry News | 2023-11-13 12:28:17.0
MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.
.png)
