Product Name: MPM Stencil Paper Roll Part No:HT16-MPM core id: 19.5mm core length: 455mm, 457mm paper width: 250mm, 300mm, 350mm, 440mm, 443mm, 445mm, 450mm. paper length: 9m, 10m, 11m, 12m. Qty:1roll/pc Color: White The standard sepcifica
New Equipment | Cleaning Equipment
Stencil Wiping Rolls are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. We manufactur
Industry News | 2011-11-08 13:28:32.0
Engineered Conductive Materials introduces its DB-1588 low-cost conductive adhesive for back contact applications in crystalline silicon solar modules.
Industry News | 2016-09-13 21:04:26.0
Engineered Materials Systems today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.
Industry News | 2016-11-15 18:10:16.0
Engineered Materials Systems today announced its new EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small- to medium-size die and tantalum capacitors. EMS 561-854 is designed to cure in one minute at 170ºC.
Career Center | Suwanee, Georgia USA | Engineering,Research and Development
MacDermid Alpha Electronics Solutions, an Element Solutions, Inc. business and world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is
Industry News | 2010-04-23 18:53:17.0
Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.
Industry News | 2009-03-06 15:54:16.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
Industry News | 2015-07-21 08:21:52.0
Engineered Materials Systems introduced its new EMS 561-403 Low-Cost Snap Cure Conductive Adhesive for stringing applications in crystalline silicon and thin-film solar modules. EMS 561-403 is designed to electrically interconnect solar cells using ribbons.
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
