Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
Industry News | 2016-08-08 20:27:23.0
Engineered Materials Systems is pleased to introduce its new EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.
Industry News | 2007-10-24 17:17:32.0
EAST WINDSOR, CT � October 24, 2007 � High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that it will feature FREE-SAT presaturated wipes in booth 1017 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center in Boston.
Industry News | 2007-11-08 22:02:38.0
EAST WINDSOR, CT � November 5, 2007 � High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that it will feature FREE-SAT presaturated wipes in Hall A4, Stand 420 at the upcoming at the upcoming Productronica 2007 exhibition and conference.
Industry News | 2011-08-29 16:29:56.0
Engineered Conductive Materials debuts its DB-1580 Series Conductive Stringer Attach Adhesives for back contact applications in crystalline silicon solar modules.
New Equipment | Fabrication Services
Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications
Industry News | 2019-08-15 07:31:59.0
AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.
New Equipment | Cleaning Equipment
DEK SMT High Performance Cleaning Rolls are engineered to boost productivity and yield, reduce the risk of defects and minimise rework. An ideal choice for a superior clean of the stencil underside. To maximise pre-placement yield, it is imperative
Industry News | 2010-12-03 22:31:01.0
Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.
Industry News | 2013-09-10 08:14:17.0
Engineered Material Systemswill introduce its DB-1588-3 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in Hall 2, stand E6 at the 28th European Photovoltaic Solar Energy Conference scheduled to take place October 1-3, 2013 at Parc des Expositions Paris Nord Villipinte in Paris, France.
