Product Name: MPM Stencil Paper Roll Part No:HT16-MPM core id: 19.5mm core length: 455mm, 457mm paper width: 250mm, 300mm, 350mm, 440mm, 443mm, 445mm, 450mm. paper length: 9m, 10m, 11m, 12m. Qty:1roll/pc Color: White The standard sepcifica
New Equipment | Cleaning Equipment
Stencil Wiping Rolls are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridging, and solder balls caused by normal printing of solder paste onto PC Boards. We manufactur
New Equipment | Cleaning Equipment
Evaporative Cooling Pad With the support from our meticulous workforce, we are introducing an extensive array of Evaporative Cooling Pad. The offered product is manufactured using superior quality basic material and advanced technology with the set i
Events Calendar | Mon Aug 13 00:00:00 EDT 2018 - Wed Sep 12 00:00:00 EDT 2018 | ,
Improving dispensing yield
Industry News | 2011-11-08 13:28:32.0
Engineered Conductive Materials introduces its DB-1588 low-cost conductive adhesive for back contact applications in crystalline silicon solar modules.
Industry News | 2016-09-13 21:04:26.0
Engineered Materials Systems today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.
Industry News | 2016-11-15 18:10:16.0
Engineered Materials Systems today announced its new EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small- to medium-size die and tantalum capacitors. EMS 561-854 is designed to cure in one minute at 170ºC.
Industry News | 2010-04-23 18:53:17.0
Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.
Career Center | Suwanee, Georgia USA | Engineering,Research and Development
MacDermid Alpha Electronics Solutions, an Element Solutions, Inc. business and world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is
Industry News | 2009-03-06 15:54:16.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
