New SMT Equipment: ramdom and bga (55)

PCB Rework and Repair Training

New Equipment | Education/Training

This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more.  Students will be introduced to the proper techniques for SMT & PTH compon

Precision PCB Services, Inc

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

Electronics Forum: ramdom and bga (322)

6 layer board and routing bga package

Electronics Forum | Fri Feb 19 05:08:40 EST 2016 | truewanderer

Thank you Tsvetan Usunov

6 layer board and routing bga package

Electronics Forum | Tue Feb 16 13:58:02 EST 2016 | tsvetan

this document http://www.latticesemi.com/view_document?document_id=671 may be good start point but note that how to escape from the BGA is not big deal, how to route your filtering capcitors, grounding, impedance control lof you high speed signals ar

Used SMT Equipment: ramdom and bga (12)

Yamaha Refurbished YV180XG Pick and Place Machine

Yamaha Refurbished YV180XG Pick and Place Machine

Used SMT Equipment | Chipshooters / Chip Mounters

Refurbished YV180XG Pick and Place Machine Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting angle ±180° (0.01° control) Mounting speed 0.095 se

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100X Pick and Place machine

Yamaha YV100X Pick and Place machine

Used SMT Equipment | Chipshooters / Chip Mounters

Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X  substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: ramdom and bga (198)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

SMTA Boston Offers Flip Chip and BGA Workshop

Industry News | 2003-03-20 09:03:05.0

Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.

Surface Mount Technology Association (SMTA)

Parts & Supplies: ramdom and bga (110)

Juki 2080 laser 8005674 and repair

Juki 2080 laser 8005674 and repair

Parts & Supplies | Pick and Place/Feeders

Supply JUKI 2080 laser 8005674 and repair Other juki parts: 40045126 HEAD L UP/DOWN SENSOR ASM 40045127 HEAD R UP/DOWN SENSOR ASM 40045132 HEAD L EJECTOR ASM 40045133 HEAD R EJECTOR ASM 40045135 FAN MOTOR(X MOTOR) ASM 40045136 LASER SENSOR CON

ZK Electronic Technology Co., Limited

Panasonic KME CM202/402/602 smt nozzle for pick and place machine

Panasonic KME CM202/402/602 smt nozzle for pick and place machine

Parts & Supplies | Chipshooters / Chip Mounters

KME CM202/402/602 smt nozzle for pick and place machine Part Number Alternative Description KXFX03DGA00 W1BCA CM202/402 NOZZLE TYPE: 110 KXFX0383A00  CM202/402 NOZZLE TYPE: 110 KXFW1BCAA00  CM202/402 NOZZLE TYPE: 110 KXFX03DHA00 W1BDA CM202/402

ZK Electronic Technology Co., Limited

Technical Library: ramdom and bga (18)

Possible reasons for simultaneous solder skip and short circuit of BGA

Technical Library | 2018-11-07 03:31:04.0

Generally speaking, there are not many cases of insufficient solder and solder short in BGA soldering, but it is not impossible. Here we discuss some elements may cause it

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

Technical Library | 2013-03-14 17:19:28.0

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.

Jet Propulsion Laboratory

Videos: ramdom and bga (317)

Yamaha S20 Modular Pick and Place Machine

Videos

Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)

Dongguan Intercontinental Technology Co., Ltd.

3D  inspection machine

3D inspection machine

Videos

LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch

AATEC Ltd

Training Courses: ramdom and bga (4)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: ramdom and bga (3)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Webinar: BGA Reballing - Theory and Hands On

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,

Webinar: BGA Reballing - Theory and Hands On

Surface Mount Technology Association (SMTA)

Career Center - Jobs: ramdom and bga (2)

Process Engineer and Technician

Career Center | , | 2001-05-16 15:58:28.0

Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning

Process and Product Support Engineers

Career Center | , New Jersey USA | Engineering

Several opportunities for skilled SMT Engineers and Product Support Engineers. Skilled in lean manufacturing and Kaizen. Skilled in working with BGA, Flip Chip and other related technologies. Skilled in new product introduction and line support acti

Circuit Search

Career Center - Resumes: ramdom and bga (1)

SMT process and equipment engineer

Career Center | BANGALORE, India | Engineering,Maintenance,Production

Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance

Express Newsletter: ramdom and bga (448)

Partner Websites: ramdom and bga (3187)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins

Heller Industries Inc.

Preowned BGA Rework Station Archives - Lewis and Clark, Inc.

Lewis & Clark | https://www.lewis-clark.com/product-tag/preowned-bga-rework-station/

Preowned BGA Rework Station Archives - Lewis and Clark, Inc. Skip to content My Cart:  $ 0.00 0 View Cart Checkout No products in the cart. Subtotal

Lewis & Clark


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PCB Handling Machine with CE

Training online, at your facility, or at one of our worldwide training centers"
Solder Paste Dispensing

High Throughput Reflow Oven
High Throughput Reflow Oven

Component Placement 101 Training Course
PCB Depanelizers

"Heller Korea"