Full Site - : ratio of weight to solder surface (Page 5 of 17)

PACE to Showcase New TF Series of BGA Rework Systems at IPC APEX EXPO 2019

Industry News | 2019-01-22 16:00:09.0

At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”.

PACE Worldwide

LPKF to Give Live Demonstration of New Multipurpose UV Laser System

Industry News | 2012-05-17 09:37:48.0

LPKF will present its in-house PCB prototyping equipment at the upcoming IMS 2012 show and will demonstrate the diverse capabilities of the ProtoLaser U3 and mechanical milling machines.

LPKF Laser & Electronics

CyberOptics’ Director of Engineering to Present Advances in Production Inspection at SMTAI

Industry News | 2014-08-28 11:58:53.0

CyberOptics Corporation (Nasdaq: CYBE) announces that Brendan Hinnenkamp, Director of Engineering, will present the paper titled “Inspection Strategies for More Accurate, Faster and Smarter Inspection” at the upcoming SMTA International exhibition.

CyberOptics Corporation

Dr. David Bernard of Nordson DAGE to Present X-ray Inspection Technology Paper at SMTA International 2011

Industry News | 2011-09-26 16:59:34.0

Nordson DAGE announces that Dr. David Bernard, Product Manager – X-ray Systems, will present a paper titled “The Implications of Recent Technology Advances for X-Ray Inspection in Electronics” at the upcoming SMTA International Conference & Exhibition.

Nordson DAGE

CyberOptics to Demonstrate Superior Technology, High Quality and Lowest Cost of Ownership at NEPCON China

Industry News | 2014-04-04 04:17:55.0

CyberOptics Corporation (Nasdaq: CYBE) announces that it will feature its latest SPI and AOI inspection solutions that come with the assurance of quality, accuracy and speed at its representative, Kasion Automation Limited (KAL) booth #B-1C22 at NEPCON China event in Shanghai (http://www.nepconchina.com/).

CyberOptics Corporation

Nordson to Exhibit Full Range of Market Leading Test and Inspection Systems at SMT/Hybrid/Packaging 2016

Industry News | 2016-04-04 09:33:43.0

Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.

Nordson DAGE

JAVAD EMS Adds Fourth Nordson YESTECH AOI System to Its Repertoire of Advanced Technologies

Industry News | 2014-11-25 16:53:07.0

JAVAD EMS (JEMS) announces that it purchased an FX AOI system from Nordson YESTECH. JEMS began working with Nordson YESTECH in 2009, implementing an F1 AOI system and later trading it in for the new FX model. Today, JEMS has four FX AOI systems on the production floor of its San Jose, CA facility.

Nordson YESTECH

Keith Bryant to Present on Behalf of YXLON International at productronica

Industry News | 2017-10-18 20:31:57.0

YXLON International is pleased to announce that Keith Bryant, Global Direcompany of the Swiss tech holding, Comet Grouptor Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.

YXLON International

ESSEMTEC to Highlight a Range of Leading-Edge Technologies at SMT Hybrid Packaging 2013

Industry News | 2013-04-10 11:48:47.0

Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

ESSEMTEC AG

Indium Corporation's Dr. Ron Lasky to Present on Design of Experiments in Upcoming Webinar

Industry News | 2022-04-13 10:15:50.0

Indium Corporation's Dr. Ron Lasky will share his technical insight on the importance of Design of Experiments to optimize the electronics assembly process as part of the company's popular InSIDER Series of webinars. The presentation, Design of Experiments (DOE) for SMT 101, will take place on Tuesday, May 3, at 10:30 a.m. San Francisco/1:30 p.m. New York/6:30 p.m. London/7:30 p.m. Germany.

Indium Corporation


ratio of weight to solder surface searches for Companies, Equipment, Machines, Suppliers & Information

Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA)

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

Training Provider / Events Organizer / Association / Non-Profit

6600 City W Pkwy
Eden Prairie, MN USA

Phone: 952-920-7682

Electronics Equipment Consignment

High Precision Fluid Dispensers
pressure curing ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Win Source Online Electronic parts

Training online, at your facility, or at one of our worldwide training centers"
design with ease with Win Source obselete parts and supplies

Training online, at your facility, or at one of our worldwide training centers"