Industry News | 2011-10-28 20:29:08.0
ERSA is pleased to offer a free ERSA Mobile Scope with the purchase of an ERSA rework system. The ERSA Mobile Scope is a new portable video microscope designed to inspect hidden solder joints of ball grid arrays (BGAs), μBGAs, chip scale packages (CSPs) and flip chips.
Technical Library | 2018-06-13 11:42:00.0
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices.
Industry News | 2003-04-15 08:23:22.0
Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.
Industry News | 2008-10-07 21:01:46.0
ESSEMTEC, the leading manufacturer in Mexico of surface mount technology production equipment for mid volumes, announces that it will showcase several SMT production systems at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008, at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.
Industry News | 2019-05-22 11:33:05.0
While no material is entirely lint-free, there are materials that are virtually lint-free. This is an important attribute to look for in your stencil wiping roll. Contaminated PC boards are a common problem. While the contamination itself is often thought of as a mystery to the printer operator, the cause may come from the stencil wiping roll. This is largely due to the sticky solder paste and sharp edges of the stencil’s apertures.
Industry News | 2019-05-22 11:33:07.0
While no material is entirely lint-free, there are materials that are virtually lint-free. This is an important attribute to look for in your stencil wiping roll. Contaminated PC boards are a common problem. While the contamination itself is often thought of as a mystery to the printer operator, the cause may come from the stencil wiping roll. This is largely due to the sticky solder paste and sharp edges of the stencil’s apertures.
Industry News | 2009-09-17 14:35:25.0
MADISON, AL — September 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E., Mark McMeen, V.P. of Engineering Services, and Casey H. Cooper, Electrical Engineering Manager will give a presentation titled “Imbedded Die Assembly Process, Is It Ready Yet?” at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session ET3 titled, “System in Packaging (SiP), which is scheduled to take place Monday, October 5, 2009 from 1-2:30 p.m. in the California room.
Industry News | 2009-04-08 15:51:43.0
MADISON, AL � April 2009 � STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Mark McMeen, V.P. of Engineering Services, will give a presentation titled, �Embedded Component Die Technology� at SMTA Huntsville, scheduled to take place on Tuesday, April 14, 2009 from 12:45-1:15 p.m.
Industry News | 2010-03-30 15:48:49.0
MADISON, AL - STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Casey H. Cooper, Electrical Engineering Manager will present a paper titled "Embedded Packaging Technologies: Imbedding Components to Meet Form, Fit, and Function" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2016-02-15 13:57:31.0
Ascentech will be introducing the new GEN3 CM+ Systems at IPC/APEX. These systems will be shown for the first time in North America during IPC/APEX. On display in booth #2225 will be the CM22+, one of the award-winning CM+ range of contaminometers from GEN3. This new design is linked to the introduction of the new process control metric introduced by GEN3, e.g., Process Ionic Contamination Testing.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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