ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
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New Equipment | Industrial Automation
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Electronics Forum | Wed Aug 25 15:24:07 EDT 2010 | mikesewell
Whatever you would normally use to print that size part on the pcb should work. Same aspect ratio rules apply for release.
Electronics Forum | Sat Mar 21 12:19:51 EST 1998 | David Pick
I have read somewhere of a ratio of component weight vs. surace contact area rule for double reflow soldering. This ratio is the maximum weight vs. surface tension to hold a component on during the second reflow. With this number, a person could weig
Industry News | 2009-03-27 13:58:34.0
Carlsbad, CA � March 27th, 2009: Machine Vision Products today announced the new Supra-E AOI will be introduced at Booth 1437 at APEX 2009 in Las Vegas from March 31st to April 2nd.
Industry News | 2009-04-17 16:59:19.0
Shanghai, P.R.C � Apr 17th, 2009: Machine Vision Products today announced the recently introduced new Supra-E AOI will be demonstrated at Booth 4F18 at Nepcon China 2009 in Shanghai from Apr 21st to April 24th.
Technical Library | 2013-06-20 14:33:12.0
With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
Career Center | Houston, Texas USA | Engineering,Management,Production
SMT Manufacturing Engineer – 2nd Shift Hunting Innova is a Houston based company serving industrial, energy, medical, defense and aerospace segments of the Electronic Manufacturing Services (EMS) Industry since 1989. Hunting Innova is located in N
Career Center | , | 2013-03-07 05:50:27.0
Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
‐18C 15 November 2008 Second issue The following is a summary of changes between ECSS‐Q‐70‐18A and the present issue: • Redrafting ECSS‐Q‐70‐18A according to ECSS drafting rules and new template. • Reorganization of the content to separate descriptive text and requirements, and creation of DRD. 3 ECSS‐Q‐ST‐70‐18C 15 November 2008 Table of contents Change log
