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BGA Rework and Reballing

BGA Rework and Reballing

New Equipment |  

LIGHTSPEEDMFG provides quick-turn BGA services including rework and reballing. It's our specialty! We're your best choice for rework, reballing, inspection, ECOs and upgrades, for BGA, CGA, �BGA, and other component types. Our advanced BGA rework

Lightspeed Mfg.

STI Electronics' BGA Reballer Kit Saves Money and Components

Industry News | 2010-09-26 16:12:24.0

STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.

STI Electronics

Cancino Technologies Lt�

Industry Directory | Manufacturer

Contract electronics manufacturer, SMT, BGA (repair and reballing), Final Assembly

NETCO Automation

Industry Directory |

NETCO Automation is a contract manufacturer that specializes on low to medium volume production. Services also include quick turn all types of BGA rework. These services include removal, attachments, reballing, and eco wires under BGA's.

Velocitech, LLC.

Industry Directory |

CEM with SMT,thruhole, BGA,CSP,test ,rework, part recovery and reballing capabilities. Medium volumes turnkey or consigned materials. Also quick turn prototypes.

Sparqtron Corporation

Industry Directory | Manufacturer

We provide Electronic Manufacturing Services (EMS) for quick-turn PCBA Prototype, NPI, PCB assembly, Box-assembly/SI, BGA Rework/Reballing

shenzhen wisdomshow technology co.,ltd

Industry Directory | Manufacturer

BGA repair machine Factory,bga reballing station,bga repair tools ,bga rework station,iphone repair machine

BGA IC Reconditioning

New Equipment |  

Recondition and Re-ball BGA IC's

BGA Bumps

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Ohio Valley Expo & Tech Forum

Industry News | 2010-06-30 12:09:49.0

MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

Whitepaper Discusses Critical Process Steps for High-Reliability BGA Device Re-balling

Industry News | 2023-07-19 09:52:10.0

The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.

Circuit Technology Center, Inc.


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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.