New Equipment | Education/Training
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure
New Equipment | Rework & Repair Services
BEST offers contract PCB rework services. If you get in bind and need resources to perform difficult repairs or if the volume of work ahead of you is too extreme to get through in the deadline at hand then consider BEST PCB rework services. If you th
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
Industry News | 2015-10-21 17:02:27.0
Product lead time reductions and increased capabilities for EMS providers and board shops
Parts & Supplies | SMT Equipment
ADJUSTABLE REBALLING KIT ADJUSTABLE REBALLING KIT Welcome to visit website www.chinaszsmt.com or mail to sales@chinaszsmt.com.
Parts & Supplies | SMT Equipment
ADJUSTABLE REBALLING KIT ADJUSTABLE REBALLING KIT Welcome to visit website www.chinaszsmt.com or mail to sales@chinaszsmt.com.
Parts & Supplies | SMT Equipment
ADJUSTABLE REBALLING KIT Welcome to visit website www.chinaszsmt.com or mail to sales@chinaszsmt.com.
Parts & Supplies | SMT Equipment
ADJUSTABLE REBALLING KIT Welcome to visit website www.chinaszsmt.com or mail to sales@chinaszsmt.com.
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Technical Library | 2013-07-11 15:22:40.0
This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).
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