Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Fri Mar 12 11:53:47 EST 2004 | Dreamsniper
Thanks Dave...it's such a good site for reworking BGA's (reballing). But what about when it comes to re-attaching the BGA onto the PCB? We are using Flextac Stencils but I found out that the apertures of their stencil is bigger than our pads for the
Electronics Forum | Sat Jul 14 08:56:39 EDT 2001 | davef
Cal is right on target. I'll expand on his points. BGA solder perform suppliers: * Winslow Automation: http://www.winslowautomation.com/ * Galahad 12784 Tulipwood Circle Boca Raton, FL 33428 561-487-0271 galahad.inc@usa.netemail: BGAKIT@concentric
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Fri Mar 02 09:08:10 EST 2001 | markkrmp
Frank, I am not talking about the masking on the PCB. I am actually talking about the masking on the solder side of the BGA. We have a very very high dollar BGA and are trying to reclaim alot for reuse. When we remove the BGA from the assembly, you
Electronics Forum | Mon Jul 07 09:32:28 EDT 2003 | caldon
There are companies that provide technologies to do this: Manncorp has a unit - http://www.manncorp.com/p-m-7500rb.htm and Winslow Automation - http://www.winslowautomation.com and http://www.ape.com/reball_kits.html and companies providing thi
Electronics Forum | Fri Mar 23 15:33:53 EDT 2007 | ppcbs
Does anyone know where to purchase 90/10 & Lead Free solder balls and kits for BGA Reballing? I'm having service problems with my current vendor who decided that they no longer wish to sell 90/10 balls, can't take in an order without a quote, and ca
