Industry News | 2020-02-01 05:00:45.0
New 3D AOI/SPI Combo, 3D AXI system for PCBAs and M2M Software
Industry News | 2022-02-25 14:38:43.0
CyberOptics® Corporation (NASDAQ: CYBE) received a 2022 CIRCUITS ASSEMBLY NPI Award in the category of Inspection for its new SQ3000+ Multi-Function system for AOI, SPI and CMM. The award was announced during a virtual ceremony on Thursday, Feb. 24, 2022.
Industry News | 2022-07-25 08:40:24.0
28th Award for MRS-Enabled Technology
Industry News | 2022-11-07 20:11:52.0
Nordson Corporation (Nasdaq: NDSN) today announced that it received three 2022 Global Technology Awards in the categories of Metrology and AOI Inspection Systems for its CyberOptics SQ3000™+ and SPI Inspection Systems for its new CyberOptics Dual-Mode Multi-Reflection Suppression® (MRS)® sensor-enabled SE3000™ SPI system. The awards were announced during a ceremony that took place Wednesday, Nov. 2, 2022 during SMTA International.
Industry News | 2009-01-19 20:34:37.0
Essemtec, the leading manufacturer of surface mount technology production equipment, announces that it will highlight the printer SP150, the pick & place machine Pantera XV and the full convection oven RO300FC-C with RO-CONTROL software in hall no. 18, stand no. 338 at the upcoming COMPONEX NEPCON 2009 exhibition, scheduled to take place February 24-26, 2009, in Delhi, India.
Industry News | 2012-01-21 00:40:52.0
Essemtec will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo.
Industry News | 2012-02-23 16:51:16.0
Universal Instruments sets a higher standard for versatility and performance in a multifunction surface mount platform with the introduction of the Genesis GX-37D to the Americas market at the APEX 2012. Universal will demonstrate the exceptional capabilities of the GX-37D on booth #2737, as well as share the company’s vision into the exciting new markets shaping the industry landscape and Universal’s unique position as a productivity and profitability leader in these markets.
Industry News | 2013-01-14 14:43:06.0
Essemtec, announces that it will showcase flexible Swiss-made solutions in Booth #3233 at the upcoming IPC APEX EXPO
Industry News | 2013-04-10 11:48:47.0
Essemtec, announces that it will exhibit numerous flexible Swiss-made solutions in Booth 7, Hall 211 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2018-03-14 13:56:58.0
Seoul, South Korea -- Koh Young Technology, the leading 3D measurement and inspection company, announced its highest-ever quarterly result - up 20 percent year-over-year. Buoyed by strong 3D AOI (Automated Optical Inspection) business coupled with tremendous 3D SPI (Solder Paste Inspection) growth, Koh Young finished 2017 as its most successful year with double-digit annual sales growth.
