Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Industry News | 2018-02-28 08:22:00.0
Essemtec has been awarded a 2018 NPI Award in the category of Dispensing for its Tarantula – Relentless All Terrain Jet Dispenser. The system features state-of-the-art technology and can be easily integrated in any line. It is designed for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.
Industry News | 2023-10-30 19:21:14.0
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
Industry News | 2010-04-14 20:57:38.0
From the recently re-energized Horizon platform, through to comprehensive print process control tools and next-generation stencil technologies, the DEK display at Nepcon Shanghai will treat booth visitors to the ultimate in print productivity. Being held from 20th – 22nd April at the Everbright Convention & Exhibition Centre, the twentieth Nepcon Shanghai event will see DEK demonstrate a selection of advanced products and processes from booth 1E08.
Industry News | 2022-05-18 13:07:51.0
SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Industry News | 2012-11-05 11:22:44.0
CyberOptics Corporation (Nasdaq: CYBE), announces that it has been awarded the Best Emerging Exhibit of the Year 2012 China East and China South by SMTA China for its all-new advanced SPI system – the SE500ULTRA™.
Industry News | 2015-08-27 13:22:43.0
Viscom announced today that it will exhibit in Booth #506 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Viscom’s applications experts will present the company’s new 3D AOI and CCI systems.
Industry News | 2020-07-09 02:25:53.0
PENANG, MALAYSIA - July 2020 - ViTrox Technologies, a world-leading solution provider of innovative, advanced and cost-effective Automated Machine Vision inspection system and equipment for the Semiconductor and Electronics Assembly industries, is pleased to introduce the V310i Advanced 3D Solder Paste Inspection System (API) designed to cater for the need of integrated vision solution for Smart Manufacturing.
Industry News | 2022-01-23 16:18:06.0
CyberOptics® Corporation (NASDAQ: CYBE) will unveil the new Dual-Mode MRS sensor for the SE3000™ SPI system in Booth #2541 at the 2022 IPC APEX EXPO, Jan. 25-27, 2022 at the San Diego Convention Center in California. The company also will demonstrate the SQ3000™ Multi-Function system for AOI, SPI and CMM and feature the new SQ3000+ Multi-Function system for advanced applications.
Industry News | 2022-09-26 06:49:21.0
29th Award Win for Proprietary MRS Sensor Technology
