Full Site - : reduce splashes (Page 3 of 3)

Paste In Hole

Electronics Forum | Thu Jun 28 10:58:28 EDT 2001 | brownsj

The question is are you talking of a reflow or wavesolder process. If your talking reflow I used to use a stepped stencil to ensure I had sufficient paste and then make a double pass with my squeegees. First pass with a 45 degree rubber squeegee to f

Solder balls

Electronics Forum | Thu Jul 17 20:46:55 EDT 2008 | davef

Which type? * Solder beads (mid-chip solder balls, attached to the waste line of your chip caps and resistors) This is more paste volume related. * Solder balls that tend to be more randomly scattered (as in spattered)? This tends to be more profile

Solder Saver ??

Electronics Forum | Tue Apr 18 06:15:49 EDT 2006 | JH

AJ, I have had the Solder Saver on trial a couple of times and reached the same conclusion both times - it is not for us. However there are benifits for some users. In case you dont know how it works, here is a brief explanation; The hand held to

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

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