Industry News | 2021-11-12 04:12:57.0
The perfect solder joint requires the perfect connection between the components because compromises lead to poor results, defects in the components and expensive rework. Weller's solder wire (WSW) platform provides only the best and exceeds expectations.
Used SMT Equipment | In-Circuit Testers
JDSU OLT55-2286/01 OLT-55 Optical Loss Test Set, integrated Laser source: wavelength 1310 and 1550 nm, power range -7 to 0 dBm, Fiber style 9/125 m SM, integrated Power meter: wavelength range 780 to 1650nm, power range -70 to +20 dBm, Ge photodi
Used SMT Equipment | In-Circuit Testers
JDSU OLT55-2286/02 OLT-55 Optical Loss Test Set, integrated Laser source: wavelength 1310 and 1550 nm, power range -7 to 0 dBm, Fiber style 9/125 m SM, integrated Power meter: wavelength range 780 to 1650nm, power range -70 to +20 dBm, Ge photodi
Used SMT Equipment | In-Circuit Testers
JDSU OLT55-2286/02 OLT-55 Optical Loss Test Set, integrated Laser source: wavelength 1310 and 1550 nm, power range -7 to 0 dBm, Fiber style 9/125 m SM, integrated Power meter: wavelength range 780 to 1650nm, power range -70 to +20 dBm, Ge photodi
Used SMT Equipment | In-Circuit Testers
JDSU OLT55-2286/01 Details JDSU OLT55-2286/01 OLT-55 Optical Loss Test Set, integrated Laser source: wavelength 1310 and 1550 nm, power range -7 to 0 dBm, Fiber style 9/125 m SM, integrated Power meter: wavelength range 780 to 1650nm, power ra
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2015-12-14 22:14:22.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature-sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2015-12-16 18:10:21.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature–sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2020-11-24 15:18:53.0
Viscom's proven S3088 CCI inspection system ensures high-precision conformal coating inspection of printed circuit boards. The system quickly and reliably detects typical defects such as cracks, coating voids, smearing and splashing. Layer thickness and wet coating can also be analyzed. The S3088 CCI now comes standard with an unmatched upper transport clearance of 105 mm, thus providing even more flexibility during final inspection of fully assembled components.
