Industry News | 2022-04-13 10:14:24.0
KIC will exhibit in Hall 4, Stand 452 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.
Industry News | 2022-05-05 17:36:27.0
KIC is pleased to announce plans to exhibit at the SMTA Juarez and Tijuana Expo & Tech Forums in Mexico. The SMTA Juarez Expo & Tech Forum is scheduled to take place Thursday, May 19, 2022 at the CIITA – IPN Chihuahua. The SMTA Tijuana Tech Day & Expo will be held Thursday, May 26, 2022 at the Quartz Hotel. Miguel Carbajal, KIC's Mexico Sales Manager, will be available to discuss Reflow Process Inspection (RPI), Wave Process Inspection (WPI), NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and solutions for thermal processes.
Industry News | 2022-08-26 09:07:56.0
KIC is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. Miguel Carbajal, KIC's Mexico Sales Manager, will be available to discuss Reflow Process Inspection (RPI), Wave Process Inspection (WPI), NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and solutions for thermal processes.
Industry News | 2022-10-04 11:44:07.0
KIC will exhibit in Booth #1226 at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. Meet with KIC's representatives to discuss Reflow Process Inspection (RPI), Wave Process Inspection (WPI), NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and solutions for thermal processes.
Industry News | 2016-03-15 16:00:03.0
Kurtz Ersa North America announces that it was awarded four 2016 NPI Awards during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center during the IPC APEX EXPO. Ersa won in the following categories: Component Placement – Multi-function for the ROBOPLACE, Soldering – Selective for the VERSAFLOW 4, Soldering – Reflow for the HOTFLOW 3/20 and Software – Process Control for the IMAGESOFT Software.
Industry News | 2012-05-30 13:23:47.0
Nihon Superior to Offer Voiding Reduction and Aluminum Soldering at Jisso Protec 2012
Industry News | 2022-08-26 08:49:05.0
KIC is pleased to announce plans to exhibit with its distributor, Hin A/S, at the E-22 Electronic Show, scheduled to take place August 30-September 1, 2022 at the OCC Messe in Denmark. Electronics manufacturing is moving into an era requiring intelligent use of large amounts of data in order to run a flexible, efficient and successful manufacturing operation. KIC is at the forefront of this trend, providing customers an easy path along this "smart factory" learning curve.
Industry News | 2024-01-29 11:33:44.0
Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
(Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT p
Industry News | 2003-03-11 09:04:04.0
Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.
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