Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
Technical Library | 2023-11-20 18:10:20.0
The electronics production is prone to a multitude of possible failures along the production process. Therefore, the manufacturing process of surface-mounted electronics devices (SMD) includes visual quality inspection processes for defect detection. The detection of certain error patterns like solder voids and head in pillow defects require radioscopic inspection. These high-end inspection machines, like the X-ray inspection, rely on static checking routines, programmed manually by the expert user of the machine, to verify the quality. The utilization of the implicit knowledge of domain expert(s), based on soldering guidelines, allows the evaluation of the quality. The distinctive dependence on the individual qualification significantly influences false call rates of the inbuilt computer vision routines. In this contribution, we present a novel framework for the automatic solder joint classification based on Convolutional Neural Networks (CNN), flexibly reclassifying insufficient X-ray inspection results. We utilize existing deep learning network architectures for a region of interest detection on 2D grayscale images. The comparison with product-related meta-data ensures the presence of relevant areas and results in a subsequent classification based on a CNN. Subsequent data augmentation ensures sufficient input features. The results indicate a significant reduction of the false call rate compared to commercial X-ray machines, combined with reduced product-related optimization iterations.
Industry News | 2023-08-29 07:21:26.0
Indium Corporation® is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at productronica India, September 13-15, in Bengalaru. A strong supporter of the Make in India campaign, Indium Corporation is committed to serving the region's growing EV market.
Industry News | 2023-09-04 13:34:43.0
Indium Corporation® is proud to showcase its proven products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at The Battery Show, September 12-14, in Novi, Michigan.
Industry News | 2016-02-11 22:57:15.0
Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, Calif.
Industry News | 2019-01-04 16:11:03.0
KIC will exhibit in Booth #1215 at the 2019 IPC APEX EXPO, scheduled to take place January 29-31, 2019 at the San Diego Convention Center in CA. Visit the KIC booth for a reflow profiling clinic for void reduction.
Industry News | 2024-03-18 13:22:09.0
SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
Industry News | 2014-02-19 16:39:50.0
Seika Machinery, Inc.announces that it will exhibit in Booth #2433 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
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