Full Site - : reduce voids (Page 3 of 44)

Count On Tools Announces Customer Success with ezLOAD Board Support System

Industry News | 2014-01-07 18:55:28.0

Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.

Count On Tools, Inc.

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Industry News | 2017-05-15 16:35:00.0

SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Two Indium Corporation Experts to Present “Best Papers” at SMTA South China Technology Conference 2018

Industry News | 2018-08-16 20:05:44.0

Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China.  Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.

Surface Mount Technology Association (SMTA)

MPM Introduces Next Generation Momentum II Printer

Industry News | 2019-11-05 12:11:26.0

ITW EAE is introducing the MPM® Momentum II™ Printer as the next generation of the highly successful Momentum printer line. The Momentum II features a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use and flexibility.

ITW EAE

MPM Completes Next Generation Momentum II Printer Line with Introduction of BTB and 100 Models

Industry News | 2020-04-14 19:07:23.0

ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.

ITW EAE

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

New Equipment | Solder Materials

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC

AIM Solder

Fill the Void II: An Investigation into Methods of Reducing Voiding

Technical Library | 2018-10-03 20:41:44.0

Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.

FCT ASSEMBLY, INC.

H10 Halogen-Free No Clean Solder Paste

H10 Halogen-Free No Clean Solder Paste

New Equipment | Solder Materials

90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r

AIM Solder


reduce voids searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
SMT feeders

Reflow Soldering 101 Training Course
pressure curing ovens

Software for SMT placement & AOI - Free Download.