Industry News | 2020-10-27 12:43:49.0
Kurtz Ersa Inc., a leading supplier of electronics production equipment,received a 2020 Mexico Technology Award in the category of Soldering Equipment – Convection for its EXOS 10/26 convection reflow soldering system. The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
With the new EXOS 10/26, Ersa GmbH presents a vacuum reflow soldering system with which the void rate can be reduced by 99%. More about the EXOS 10/26 ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/reflow-soldering/pr
Industry News | 2009-07-28 11:43:13.0
OSAKA, JAPAN — July 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that a new presentation about the challenges and issues in lead-free soldering is now available on the company’s Web site.
Industry News | 2019-12-16 22:45:13.0
Vacuum soldering system is a kind of process welding furnace for high-end products, such as laser devices, aerospace, electric cars and other industries, compared to the traditional chain furnace, has great technical advantages.
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Industry News | 2010-07-29 14:23:35.0
Christopher Associates announces that a Bay area thin film photovoltaic manufacturing company recently adopted the Japan Unix ‘Unisonik’ soldering system for its large panel soldering needs.
Industry News | 2014-09-04 23:32:50.0
Indium Corporation's Wolfgang Bloching, regional sales manager for Germany, Austria, and Switzerland, will present at Yamaha Technology Day on Oct. 1 in Neuss, Germany.
Industry News | 2015-12-01 11:54:37.0
Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
