Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Fri Aug 14 08:59:51 EDT 1998 | Dave F
| | | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | | Xingsheng | | Xingsheng: Welcome. | | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | | Web resources: htt
Industry News | 2009-04-13 16:23:27.0
ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2010-06-21 14:24:32.0
RANCHO CUCAMONGA, CA — Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, introduces the Trident OneShot automatic defluxing and cleanliness testing system. Trident OneShot is designed to provide automatic cleaning (de-fluxing), cleanliness testing, and drying of post-reflow circuit assemblies. The system provides the same cleaning, cleanliness testing, and drying performance of the multi-award winning Trident III Series at almost half of the cost.
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
°C Temperature Range [7] Kim’s investigation utilized two different reflow profiles – typical (aka LSLP) and non-typical (aka Extreme) – to generate voids in the BGA solder joints
| http://etasmt.com/cc?ID=te_news_bulletin,23566&url=_print
gas phase Formic Acid (HCOOH) to replace standard fluxing agents Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps No post-reflow flux clean facilitates inline application of epoxy and inline epoxy
