Industry News | 2021-10-07 15:10:50.0
KIC will exhibit in Booth #3101 at SMTA International, scheduled to take place Nov. 3 - 4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Along with Reflow Process Inspection (RPI) and Wave Solder Process Inspection (WPI), the KIC team will discuss NPI setup, process optimization for reduced defects, improved OEE, and their complete ecosystem of solutions for thermal processes.
Industry News | 2022-04-13 10:14:24.0
KIC will exhibit in Hall 4, Stand 452 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.
Industry News | 2022-08-26 09:07:56.0
KIC is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. Miguel Carbajal, KIC's Mexico Sales Manager, will be available to discuss Reflow Process Inspection (RPI), Wave Process Inspection (WPI), NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and solutions for thermal processes.
Industry News | 2011-11-20 13:48:27.0
The Balver Zinn Group and Cobar Europe BV announces that it has been awarded a Global Technology Award in the Flux Materials category for its SCAN-Ge071-XF3+ solder paste.
Industry News | 2021-10-11 16:06:46.0
KIC will exhibit in Hall A2, Stand 316 at productronica, scheduled to take place 16-19 November 2021 at the Messe München in Germany. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.
Industry News | 2021-12-21 15:06:19.0
KIC will exhibit in booth 3009 and the Factory of the Future Pavilion at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022, at the San Diego Convention Center San Diego, CA. The KIC team are thermal process experts who make ovens smarter. Along with award-winning Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and their complete ecosystem of solutions for thermal processes.
Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ
I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component
Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ
I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component
Electronics Forum | Mon May 27 15:11:25 EDT 2013 | ericrr
Interesting, I could not find anything via a website search some of the links came up as 404, others a "home" page and some never went at all (or took too long) So I turned to google and found http://www.smtinfo.net/docs/tombstoning.pdf a 16 page a
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
