Industry News | 2021-03-30 11:44:23.0
Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.
Industry News | 2018-11-14 15:48:25.0
Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA.
Industry News | 2022-09-19 05:59:24.0
Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.
Industry News | 2016-03-30 09:22:53.0
Ersa is pleased to announce that it will exhibit a wide range of industry leading technologies in Hall 7, Booth 117 at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. Additionally, the company will exhibit the VERSAFLOW3/45 with VERSASCAN and VERSAEYE for the first time.
Industry News | 2016-09-01 19:24:28.0
KIC today announced that Marybeth (MB) Allen will present “Optimized Reflow Profiling to Minimize Voiding” during SMTA International. The presentation is scheduled to take place during the IPC Session ‘Lead-Free Symposium,’ Session LF2 on Thursday, Sept. 29, 2016 from 11 a.m.-12 p.m.
Industry News | 2018-10-09 14:46:48.0
Kester will be exhibiting (booth #117) at SMTAI 2018, which will take place October 16-17 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2023-08-29 07:21:26.0
Indium Corporation® is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at productronica India, September 13-15, in Bengalaru. A strong supporter of the Make in India campaign, Indium Corporation is committed to serving the region's growing EV market.
Industry News | 2023-09-04 13:34:43.0
Indium Corporation® is proud to showcase its proven products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at The Battery Show, September 12-14, in Novi, Michigan.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
