Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Wed Feb 06 19:28:43 EST 2002 | sleech
I agree with Francois. We have just announced a 55 deg. C LTVP drying process that can greatly speed moisture removal. It is also effective for drying components that remain in tape and reel, conductive plastic shipping tubes or trays. Process time
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Sat Aug 25 08:39:15 EDT 2007 | gsala
If plastic Carrier Tape (CT)/ emboss tape, is made by: a)Polycarbonate material, it can withstand temperature around 120C� or may be more mantaining original dimension. b)Polystirene material, at max 45�C-50C� the CT starts to change dimensions and
Electronics Forum | Mon Apr 24 17:42:34 EDT 2000 | Dave F
Rich: Awww, don�t worry that you have to ship product. This moisture sensitive part thing is more important. ;-) And don�t worry that everyone is giving you guff and no one is supporting you. Yours is a thankless job. ;-) You got it right!!!
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