Industry News | 2012-08-08 17:44:58.0
IPC Recently released, IPC-7527 was the brainchild of Task Group Nordic (TGNordic), IPC’s volunteer standards development group in Scandinavia.
Industry News | 2012-08-27 16:14:13.0
Theoretical physicist, best-selling author and futurist Dr. Michio Kaku has been selected through a vote of IPC members to be the IPC APEX EXPO® 2013
Industry News | 2012-12-13 13:23:38.0
IPC-7527, Krav til Tinpastatryk, is also the first standard ever developed that focuses on the application of one of the industry’s most basic infrastructure elements, solder paste.
Industry News | 2013-09-06 15:42:34.0
IPC – Association Connecting Electronics Industries® announces its online store is selling the 2013 Roadmap from the International Electronics Manufacturing Initiative (iNEMI) through a special agreement between the two organizations.
Industry News | 2023-01-23 18:52:10.0
Magazine celebrates member success
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Industry News | 2018-08-16 19:58:50.0
The SMTA Capital Chapter is holding its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 23rd.
Industry News | 2021-09-30 16:20:50.0
IPC is calling on the U.S. electronics manufacturing community to contact members of Congress about a bill that would boost investment in federal research and development (R&D) in 10 high-tech fields. We hope your media organization will help us publicize this effort.
Industry News | 2019-08-21 16:17:24.0
Nordson ASYMTEK introduces its Forte™ Series fluid dispensing system. The Forte Series combines high accuracy fluid dispensing with increased throughput and productivity in a narrow footprint to handle applications such as flex circuit and printed circuit board assembly, electro-mechanical assembly, MEMS, underfill, precise coating, and encapsulation.
Industry News | 2011-11-11 14:38:51.0
Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
