Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Industry News | 2016-09-11 12:12:28.0
SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Reception, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the NEPCON South China Show.
Industry News | 2015-03-02 21:09:35.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
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Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.
Industry News | 2021-02-08 15:16:46.0
BTU International, Inc. will participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company will highlight the PYRAMAX™ Vacuum reflow oven during the virtual event.
Industry News | 2013-01-18 13:35:03.0
Secures First DYNAMO™ Order from Key Customer in China
Industry News | 2019-12-16 22:31:09.0
Vacuum reflow solder is refers to the vacuum eutectic oven, vacuum in vacuum environment for high quality welding products, in the welding process of zhongtong into reducing system (N2, formic acid, N2H2, H2), to protect the product and the solder is not oxidized, at the same time the product and solder oxide on the surface of the reaction, make weld surface quality improvement, reduced the rate of welding hollow.
Industry News | 2013-06-10 12:19:40.0
BTU International, Inc., will highlight its controlled atmosphere furnaces and convection reflow ovens in Booth #2622 in the South Hall at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013, at the Moscone Center in San Francisco, CA.
Industry News | 2013-03-07 14:04:01.0
BTU International, Inc.will showcase its new DYNAMO™ solder reflow oven in booth #D60 at the 27th International Electrical, Energy and Automation Industry Fair (FIEE), scheduled to take place April 1-5, 2013, at the Anhembi Exhibition Centre, in Sao Paulo, Brazil.