Used SMT Equipment | Conveyors
1.34M long edge belt conveyor. Left to Right process flow, front fixed rail. We can program for point to point transfer, or indexing for post reflow use. Hand crank for up to 18 inch width. small indent in front panel. no other defects. (110V)
New Equipment | Assembly Services
WORK BOARD HOLDERS TOOLING TO HOLD PRINTED CIRCUIT BOARD IN PLACE OVER INSERTION & PICK AND PLACE MACHINE SELECTIVE SOLDER PALLETS TO ELIMINATE MANUAL MASKING OF PRINTED CIRCUIT BOARD'S BEFOR THEY GO OVER WAVE. PALLETS HELP WITH DEFECTS AND E
There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Industry News | 2016-03-30 20:06:51.0
BTU International today announced that Fred Dimock will present during the SMTA webtorial entitled, “Solder Reflow Fundamentals Understanding Thermal Profiles and Defect Mitigation” The webtorial is scheduled to take place April 26-28th.
Industry News | 2012-09-13 13:58:17.0
Viscom will exhibit in Booth #415 at the upcoming SMTA International Exhibition,
New Equipment | Board Handling - Storage
Effective moisture damage solution that improves yields. http://eurekadrytech.com/fast-super-dryer/tus-101 Capacity: 93 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing door for 30 seconds or les
This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for
Industry News | 2013-09-16 14:30:00.0
Viscom today announced that it will exhibit the S3088 AOI system in Booth #427 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2012-01-19 23:09:10.0
Viscom proudly announces that it will exhibit its recently introduced 3-D SPI system in Booth #2629 at the upcoming IPC APEX Expo. The system is now available with the unique SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.
