Full Site - : reflow defect (Page 14 of 132)

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

Return on Investment of a Pre-Reflow AOI System

Technical Library | 2015-06-30 22:02:41.0

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An evaluation method to select a pre-reflow AOI system maximizing the return on investment (ROI) is introduced. In the end, ROIs of three commercial pre-reflow AOI systems are compared to demonstrate the importance of selecting an appropriate AOI system. This paper will increase the probability that anyone installing an AOI system during the pre-reflow process will obtain a successful gain with short payback period.

CyberOptics Corporation

SV-4000

New Equipment |  

SUPERIOR VISION 4000 � SUPERIOR SOLDER DEFECT DETECTION The Photon Dynamics Superior Vision (SV) 4000 AOI system delivers comprehensive defect detection. Designed for high-pulse production of large-format, high-density and small component PWAs, t

Photon Dynamics (Acquired by KLA Corporation)

SV-6000

New Equipment |  

SUPERIOR VISION 6000 � UNRIVALED SOLDER DEFECT DETECTION The Photon Dynamics Superior Vision (SV) 6000 AOI system delivers comprehensive defect detection. Designed for high-pulse production of large-format, high-density and small component PWAs,

Photon Dynamics (Acquired by KLA Corporation)

Bob Willis Free EBooks on PoP and Intrusive Reflow Design & Assembly

Industry News | 2015-02-19 10:13:46.0

In the last couple of years Bob has produced two free EBooks for engineers, each with over 100 pages of information, tips and illustrations to make introduction easier. Both titles are based on practical experience using these techniques in manufacture in different sites.

ASKbobwillis.com

Viscom to Exhibit AOI/AXI Capabilities and New Process Uplink at IPC Midwest 2012

Industry News | 2012-07-25 11:01:54.0

Viscom will exhibit in Booth #403 at the upcoming IPC Midwest Exhibition & Conference

Martel Marketing Communications, Inc.

Guide to QFN/LGA & BTC Process Defects Launched by SMART Group

Industry News | 2017-09-05 16:01:43.0

SMART Group, Europe’s largest technical trade association focusing on Surface Mount And Related Technologies, announces that its latest Process Defect Photo Guide “Guide to QFN/LGA & BTC Process Defects” will be released on 16th October. This optical and X-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts. It shows issues at goods receipt, typical assembly-related problems plus solder joint and cleanliness failures that can occur in the field. The guide provides example images of satisfactory print, placement and reflow with many common defects found with optical and X-ray inspection.

The SMART Group

Guide to QFN/LGA & BTC Process Defects Guide & FREE webinar from Bob Willis

Industry News | 2017-09-03 08:06:25.0

Our latest Process Defect Photo Guide entitled “Guide to QFN/LGA & BTC Process Defects” will be released on 16th October. This optical and x-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts

ASKbobwillis.com

S3088 flex - High-speed AOI of Fine-pitch Components

S3088 flex - High-speed AOI of Fine-pitch Components

New Equipment | Inspection

Extremely reliable, proven inspection for wave, reflow, pre-reflow and selective soldering. The S3088 flex AOI system was developed for reliable, economical defect detection and fast process optimization. From prototypes to large volume, this flexib

Viscom AG

01005 Assembly, the AOI route to optimizing yield

Technical Library | 2009-07-15 12:14:31.0

The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines. With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005.

Vi TECHNOLOGY


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