Dual lane system with a multi-segment board capability The 7K Dual Lane Series offers large-board capabilities up to 21’’ x 11’’ for each of the two lanes. The multi-segment dual-lane conveyors respond to floor-space constraints as well as AOI produ
Full Viscom 2.5D defect detection coverage for placement and solder joint inspection. Extremely reliable, proven inspection for reflow, pre-reflow, wave and selective soldering Revolutionary simplicity in AOI operation with vVision Scalable came
Industry News | 2016-03-14 05:03:19.0
We have written two eBook’s Guide to Pin In Hole Intrusive Reflow Design and Assembly and Package On Package Design and Assembly, both are available to download free of charge
This is a brief demonstration showing the 2014 YESTech FX operating. This machine is available at the Capital Equipment Exchange. www.ce-exchange.com
Industry News | 2008-09-12 03:37:05.0
KIC will showcase the newest standard feature of its KIC 24/7 Thermal Management System in booth 301 at the IPC Midwest Conference & Exhibition.
ORPRO Vision SPI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion P36 Plus SPI system. For additional information, please contact ORPRO Vision at sales.us@orprovision.com sales.eu@orprovision
Industry News | 2021-07-27 16:16:17.0
Indium Corporation's Iván Castellanos, technical services manager for Latin America, will host two sessions of an InSIDER Series webinar on the basics of reflow profiling. The first session will be on Tuesday, Aug. 17 at 3 p.m. Central/4 p.m. Eastern, followed by the second session on Thursday, Aug. 19 at 3 p.m. Central/4 p.m. Eastern.
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
Industry News | 2015-08-25 06:51:43.0
I will be presenting two soldering workshops and one hands-on solder paste printing & inspection feature at SMTA International in September. Watch our video clips to find out more and the new topics we will be covering during my birthday celebrations
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
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