New Equipment | Rework & Repair Equipment
PDR E3M Rework System for Micro SMD Rework is made of only the finest materials and components for Micro- BGA Rework, 0201 Rework, CSP Rework, uBGA Rework, LED Rework, area Array Rework, and similar micro applications. Combining PDR's ThermoActive s
New Equipment | Rework & Repair Equipment
The PDR E3S SMD Rework Station offers dual closed loop feedback for advanced BGA Repair, QFN Repair, Flip Chip Repair, DFN repair, QFP's, SOIC's and more, and is is engineered with only the finest materials and components for optimum precision and r
Electronics Forum | Fri Feb 10 13:25:35 EST 2017 | dilogic
Today I tried to reflow a PCB for the first time. It did not went well. Can anybody tell me what did I do wrong?
Electronics Forum | Wed Feb 15 08:57:48 EST 2017 | dilogic
I tried several times - it squeaked for a while and then silence...
Industry News | 2018-10-18 08:37:41.0
How to optimize the reflow profile?
Industry News | 2018-10-18 10:12:06.0
Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?
Technical Library | 1999-05-07 08:50:40.0
To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
The Access Control Face Recognition system is a very widely used product. It is currently not only used in residential buildings and office buildings, but also in many scenarios. For example, corporate attendance: Some companies also use the acces
This video shows the NEW PDR IR-D3i SMT / BGA Rework station in action! Using PDR's patented Focused IR technology, the D3i & D3Vi Discovery series Rework systems have been specifically designed to cope with the challenges of repairing today's PCB
| https://productronica.com/en/trade-fair/press/press-releases/detail/microelectronics-one-of-the-key-industries-of-our-time.html
3.2 percent at the same time. Among other things, the trend is caused by the strong demand for electronics equipment for people working from home (e.g. PCs
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications Yue Deng1,*, Xike Zhao2
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