SMTnet Express, December 12, 2013, Subscribers: 26406, Members: Companies: 13519, Users: 35511 Using Physics of Failure to Predict System Level Reliability for Avionic Electronics by Greg Caswell; DfR Solutions Today's analyses of electronics
SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia
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centipoises (kcPs). Voids Cavities inside a solder joint containing liquids and gases trapped during reflow. W Water Soluble Paste (WS) A mixture of organic acids, thixotrope, and solvent. WS flux comes in a wide range of activity levels for soldering to
