Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Industry News | 2021-11-22 07:27:39.0
MIRTEC is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Inspection – AOI systems for its MV-9 SiP HYBRID 3D AOI system. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2016-11-14 20:04:34.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that SMT Hautes Technologies, has selected MIRTEC’s award winning MV-7 OMNI as their future 3D AOI platform of choice.
Industry News | 2015-08-24 14:59:01.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it will exhibit in Booth #407 at SMTA International, scheduled to take place Sep. 29-30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will showcase the latest advancement MIRTEC’s award-winning 3D AOI and SPI systems during the two-day event.
Industry News | 2013-04-17 11:18:13.0
MIRTEC Co., Ltd. today announced that it will premier its complete line of 3D AOI, SPI and LED inspection systems in Booth #1G68 at NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
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