Industry Directory: reflow moving bottom (6)

Sikama International, Inc.

Industry Directory | Manufacturer

Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.

LaserJob

Industry Directory | Manufacturer

Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.

New SMT Equipment: reflow moving bottom (166)

Heller 2156 MK7 SMT Reflow Oven

Heller 2156 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2156 MK7 SMT Reflow Oven Heating Zones: Top 17/ Bottom 17PCB Width:50 - 560 mmLength: 869cmProduct description: Heller 2156 MK7 SMT Reflow Oven, Heating Zones: Top 17/ Bottom 17, PCB Width:50 - 560 mm, Length: 869cm   Heller 2156 MK7 SMT R

Qersa Technology Co.,ltd

Heller 1809 MK7 SMT Reflow Oven

Heller 1809 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1809 MK7 SMT Reflow Oven Heating Zones: Top 8 / Bottom 8PCB Width:50 - 560 mmlength: 465cmProduct description: Heller 1809 MK7 SMT Reflow Oven, Heating Zones: Top 8 / Bottom 8, PCB Width:50 - 560 mm, length: 465cm   Heller 1809 MK7 SMT Ref

Qersa Technology Co.,ltd

Electronics Forum: reflow moving bottom (1172)

SMD module moving during reflow

Electronics Forum | Wed Jun 19 01:07:32 EDT 2019 | relaycz

Drop of glue should prevent module from moving, but is not really a solution. What about pad design? Are pads on PCB themselves much larger then the ones on the module?

SMD module moving during reflow

Electronics Forum | Wed Jun 19 17:44:38 EDT 2019 | slthomas

Does the part have a ground/thermal pad underneath or are all terminations on the perimeter?

Used SMT Equipment: reflow moving bottom (148)

Electrovert Omni 7

Electrovert Omni 7

Used SMT Equipment | Soldering - Reflow

1997 Electrovert OMNI 7 Reflow Oven Left to Right 7 Heating Zones (Top & Bottom Heaters) Edge & Mesh Transport Power: 480 VAC; 101.2A; 60Hz; 3 Phase Machine Dimensions: 194" x 54" x 56" Serial: 11871242

Baja Bid

Quad ZCR 941C

Quad ZCR 941C

Used SMT Equipment | Soldering - Reflow

Reflow Oven Features: 4 Top Zones 4 Bottom Zones Edge & Mesh SMEMA

Baja Bid

Industry News: reflow moving bottom (404)

Lean Stream & Heller Reflow Technology to Partner in CA & NV

Industry News | 2015-11-12 22:03:28.0

Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!

Heller Industries Inc.

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

Parts & Supplies: reflow moving bottom (21)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Technical Library: reflow moving bottom (10)

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Fill the Void V - Mitigation of Voiding for Bottom Terminated Components

Technical Library | 2020-12-29 20:55:46.0

Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).

FCT ASSEMBLY, INC.

Videos: reflow moving bottom (322)

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

HELLER INDUSTRIES Presents: 1936 MKV Vacuum Reflow Oven

Videos

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

BTU 150N Reflow Oven

BTU 150N Reflow Oven

Videos

2004 BTU Pyramax 150N X5 Reflow Oven 10 Zones (Top and Bottom Side Heaters) 2 Cooling Zones Edge Rail & Mesh Belt 7819 Operating Hours Nitrogen Capable Power: 380 / 220VAC; 3 Phase; 119A Machine Dimensions: 260" x 60" x 65"

Baja Bid

Training Courses: reflow moving bottom (1)

Lead-Free Soldering Online Training

Training Courses | ONLINE | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Automated Learning

Events Calendar: reflow moving bottom (5)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1

Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,

Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1

Surface Mount Technology Association (SMTA)

Career Center - Jobs: reflow moving bottom (6)

Sales Manager

Career Center | Garland, Texas USA | Sales/Marketing

Electronics Manufacturing Company is looking for FT/PT full commission sales personnel, 25% and up commission base on value of orders ( not the bottom line). Experience on handling own sales accounts. Extra income for referrals, if you have business

1ST ARTICLE

SMT Process Engineer

Career Center | , New Zealand | Engineering,Production

We require a fully qualified SMT Engineer to take up the challenge of moving our SMT from great to world class as part of our Process Engineering Team. Reporting to the Engineering Manager the ideal candidate will have a proven track record (5 - 10 y

GPC Electronics Ltd

Career Center - Resumes: reflow moving bottom (8)

NPI Engineer

Career Center | Theni, Tamilnadu India | Engineering

NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu

Sr. Process Improvement Engineer

Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support

Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.

Express Newsletter: reflow moving bottom (931)

Partner Websites: reflow moving bottom (1089)

SMT Reflow Soldering Oven Reflow-SMT Reflow Oven-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

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Universal Ai Bottom Guide 44896901 Ai Spare Parts For Universal Instruments

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