Full Site - : reflow oven 5 zones (Page 70 of 308)

Heller Heller 1800

Used SMT Equipment | Soldering - Reflow

Siemens Siplace HS50,S23HM,S20,F5,F3 for sales immediately Dear All:   My own SMT factory have the following SMT machines for immediately sales, all of the machines and accessories are working condition: 1#, Printer:  MPM UP2000 Hie   2 sets  

Zhu Hai Xie Chuang Electronics Co.Ltd

SRF 30/70 Series Reflow Soldering System

SRF 30/70 Series Reflow Soldering System

New Equipment | Reflow

SRF30 - Nitrogen Reflow Oven SRF70 - Air Reflow Oven Heating and cooling function applicable for the lead-free soldering of various boards By increasing the number of heating zones and adopting reflow soldering system, the temperature prof

Hanwha Techwin CO., LTD.

Ersa SAI-838

Used SMT Equipment | Soldering - Reflow

We have ETC 8-zones  reflow oven for sale .

Yi Heng Trading Co., Ltd

Heller Any

Used SMT Equipment | Soldering - Reflow

Wanted reflow oven with at least  9 Zones,  7 heating and 2 cooling. 

Tara Semiconductor Technology Irl Ltd

Quad ZCR

Used SMT Equipment | Soldering - Reflow

Quad ZCR edge and mesh 4 zone reflow oven. Excellent shape.

TDS

Lead-free Reflow Profile: Soaking type vs. Slumping type

Industry News | 2018-10-18 08:44:36.0

Lead-free Reflow Profile: Soaking type vs. Slumping type

Flason Electronic Co.,limited

Heller 1707 MKIII Reflow Oven (2017)

Heller 1707 MKIII Reflow Oven (2017)

Used SMT Equipment | Soldering - Reflow

Heller 1707 MKIII Reflow Oven (2017) Brand: Heller Model: 1707 MKIII Year: 2017 Serial #: 1117S3-B7A2S-49836-02 Type: Reflow Oven Machine specifications: Heating zones: 7 top, 7 bottom Cooling zones: 1 60-350C temperature range Left to R

Tekmart International Inc.

Heller 1707 MKIII Reflow Oven (2009)

Heller 1707 MKIII Reflow Oven (2009)

Used SMT Equipment | Soldering - Reflow

Heller 1707 MKIII Reflow Oven (2009) Brand: Heller Model: 1707 MKIII Year: 2009 Serial #: 0909S3-B7A2S-84592-03 Type: Reflow Oven Machine specifications: Heating zones: 7 top, 7 bottom Cooling zones: 1 60-350C temperature range Left to R

Tekmart International Inc.

Horizontal Convection Reflow Technology Defined

Technical Library | 2009-12-23 16:55:08.0

Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ever. In each chamber or “zone”, air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a “cyclone” around the board. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This technology is ideal for the precise profiles needed for lead free soldering.

DDM Novastar Inc

MEGARIDER™ Reflow Oven Analysis Test Boards

MEGARIDER™ Reflow Oven Analysis Test Boards

New Equipment | Reflow

The MEGARIDER™ family helps you to know more about the behavior of your oven. Use them to characterize for development, verify for production, or qualify pre-purchase. Equal masses across the width of the boards, permit PCB-like profiles that give in

Electronic Controls Design Inc. (ECD)


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