Electronics Forum | Sun Apr 12 21:37:52 EDT 2009 | padawanlinuxero
HI !!! We have the same oven! and yes profiling is hard, but not that bad. Check with the solder paste company for information, right out of my head dont remember for the temps that we use on mondayIcan show you my profile so that youhave an idea
Electronics Forum | Mon May 27 18:51:17 EDT 2002 | harotec
Hi Yngwie Have you got a reflow oven yet. If not, forget about complicated profiling with test runs or reflow trackers. We've got a nice oven with integrated temperature-feedback system. You build any profile you want and the oven will adjust its hea
Electronics Forum | Wed Aug 08 12:14:26 EDT 2012 | jorge_quijano
Hi, We have a client requiring us to use a Vapor Phase Reflow Oven instead of our convection oven, the new PCB design will be ~9.3mm thick with some SMD & Pressfit connectors, does the PCB thick could be the cause of they requiring us the Vapor Phase
Electronics Forum | Mon Dec 04 12:35:11 EST 2006 | Rob
Hi AJ, Issues we have seen: Test houses not explaining results adequately/customers with their own XRF equipment not sure what they are looking for, resulting in lots of goods in rejections/requests to return stock mostly centered around: 1) Lead
Electronics Forum | Tue Oct 26 10:49:00 EDT 2004 | Simon UK
Hi, > > I'm planning to get a new oven. I wanna > know the advantages and disadvantages of each > oven type over each other. I'm being told to go > for an 8 zone oven. > > thanks for your > help. > > regards, Depends really if you want a dua
Electronics Forum | Tue Nov 05 10:55:41 EST 2019 | engmagana
Hi Ameen, Did you fix it? I had the exact same problem with the same type of coil , check the images , LF solder SAC305, we have adjusted the solder apertures to the minimum solder required to have a strong joint enough to break the pad from the bo
Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L
Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps
Electronics Forum | Mon Jun 13 09:25:58 EDT 2011 | milroy
Hi I have seen some of our multilayer PCBs are having delamination issues even after baking them in the ovens. Does anybody faced this issue before? The problem occured after reflow process and wave solder process as well. The temp profiles are well
Electronics Forum | Mon Jul 01 19:43:44 EDT 2013 | kumar_antom
Hi there, Its a lead free process and the paste that we're using is with this alloy composition : Sn,Ag,Cu,Bi,In.... Pls refer to the attached temp.profile.... This is a mirror Pcb....Same components on both A and B side.... A side doesn't have t
Electronics Forum | Mon Dec 12 15:27:21 EST 2016 | marcpeo
Hello Sr. Tech, please disregard the board temp. > it should be the actual value displayed, the PV > at 145 deg. while the SP @ 140deg. > Hello Sr. Tech, please disregard the board temp. > it should be the actual value displayed, the PV > at 14
