Industry Directory | Consultant / Service Provider / Manufacturer / Other
Masach Tech specializes in board level EMI/RFI shielding design and production. Founded in 1994, Masach is a globally recognized and leading supplier of some of the world’s largest electronic companies, driven by highest quality..
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
Electronics Forum | Tue Sep 10 08:22:36 EDT 2002 | davef
I doubt that the interposer is FR4, it's more likely to be BT. Warp during reflow is a function of material a reflow recipe. Your ramp is too fast and is causing the interposer to bend like a potato chip.
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Used SMT Equipment | Pick and Place/Feeders
Panasonic NPM-W2 PCB mounter machine The new NPM-W2 amplifies the original NPM-W capabilities with a 10% throughput boost and 25% more accuracy. It also integrates new innovations like our incomparable Multi Recognition Camera. Combined, these feat
Used SMT Equipment | Pick and Place/Feeders
Panasonic NPM-W2 PCB mounter machine The new NPM-W2 amplifies the original NPM-W capabilities with a 10% throughput boost and 25% more accuracy. It also integrates new innovations like our incomparable Multi Recognition Camera. Combined, these feat
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Technical Library | 2020-04-01 23:32:29.0
Low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170 and 200oC soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as warping during assembly, and permit use of lower cost substrates. Sn-Bi alloys have lower melting temperatures, but some of its performance drawbacks can be seen as deterrent for its use in electronics devices.Here we show that non-eutectic Sn-Bi alloys can be used to improve these properties and further align them with the electronics industry specific needs. The physical properties and drop shock performance of various alloys are evaluated, and their results are analysed in terms of the alloy composition, including Bi content and alloying additions.
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/grnreflo.pdf
The Greening of the Reflow Process The Greening of the Reflow Process July 2001, EP& P Magazine Atsushi Kikuchi Sony Electronics The Greening of the Reflow Process, Through Partnership by Atsushi Kikuchi After years of concentration on resolving productivity-related concerns such as
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-46-open-connections-found-on-bga-components
: Open Connections Found on BGA Components Question: We have been stumped by occasional opens at the corner balls of some BGA components after reflow