The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Technical Library | 2023-01-17 17:25:14.0
BTC Void Reduction For Yield and Performance Enhancement
Technical Library | 2023-01-17 17:29:40.0
A Practical Investigation into the Use of No Lead Solders for SMT Reflow
Used SMT Equipment | Soldering - Reflow
10 Heat Zones Voltage: 380V Max PCB size: 18" Feed Direction: L-R Additional Options: EHC, Dual Lane (MFFM), Fan Speed Control, CBS, Reactor, Cool Pipe
Nano-copper sintering in formic acid vapor.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2023-01-17 18:07:31.0
To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process.
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
