Full Site - : reflowing previous solder joints (Page 4 of 215)

Ball Grid Array (BGA) Voiding Affecting Functionality

Technical Library | 2020-11-09 16:59:53.0

A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.

ACI Technologies, Inc.

What is the working principle of I.C.T Lyra Reflow Oven

Industry News | 2022-11-11 07:33:41.0

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.

Dongguan Intercontinental Technology Co., Ltd.

DIP Double-side Camera Online AOI Machine ETA-V5300

DIP Double-side Camera Online AOI Machine ETA-V5300

Videos

DIP Double-side Camera Online AOI Machine ETA-V5300​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac

Dongguan Intercontinental Technology Co., Ltd.

Online AOI Machine

Online AOI Machine

Videos

ETA DIP Inverted Camera Online AOI Machine ETA-V5200 ​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m

Dongguan Intercontinental Technology Co., Ltd.

Solder Paste and Solder Joint Automatic Inspection Experience at SMTA International

Industry News | 2015-07-06 10:34:12.0

The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.” This special feature will take place during both days of the SMTA International Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois on September 29 - 30, 2015.

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter will host a FREE webinar with Fred Dimock, BTU International, on January 20th

Industry News | 2021-01-06 17:17:19.0

The SMTA Capital Chapter is excited to host the first chapter webinar of 2021 on January20that11:00 AM EST.Fred Dimock, BTU International, will be presenting "Operation of a Vacuum Reflow Oven with Updated Void Reduction Data."

Surface Mount Technology Association (SMTA)

ASM SMT Chip Shooter SIPLACE TX

ASM SMT Chip Shooter SIPLACE TX

Videos

ASM SMT Chip Shooter SIPLACE TX If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, ASM SMT m

Dongguan Intercontinental Technology Co., Ltd.

Yamaha Modular PCB Chip Shooter

Videos

Yamaha Σ-G5SⅡ Premium Modular PCB Chip Shooter ❙ Features of Yamaha PCB Chip Shooter High-efficiency SMT pick and place machine, Yamaha chip shooter, Yamaha module type mounting system with combine high productivity,, high

Dongguan Intercontinental Technology Co., Ltd.

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Four Speakers

Industry News | 2008-10-26 00:28:46.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dave Adams (Session Chair) of Rockwell Collins, Lee Flasche of Delphi Electronics Group, Dr. Ning-Chen Lee of Indium Corporation, Steve Hugh of Philips Medical, and Dr. Ken Dishart formerly of DuPont will present in Session 4 on Lead-Free Cleaning. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008

Association Connecting Electronics Industries (IPC)


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