New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
New Equipment | Selective Soldering
On-line DIP Selective Wave Soldering Machine Our online selective wave soldering machines are the perfect solution for businesses that need to perform high-precision soldering on PCB assemblies. Our machines use a unique wave soldering process that
The Access Control Face Recognition system is a very widely used product. It is currently not only used in residential buildings and office buildings, but also in many scenarios. For example, corporate attendance: Some companies also use the acces
Hanwha DECAN S2 Pick and Place Machine High Speed:92,000 CPH(HS10 head) PCB Size : L510xW460mm Feeder position:120ea Weight: 1,800kg INQUIRY Hanwha DECAN S2 Pick and Place Machine Specifications: Hanwha DECAN S2 Pick and Place Machine Ha
Hanwha DECAN S2 Pick and Place Machine High Speed:92,000 CPH(HS10 head) PCB Size : L510xW460mm Feeder position:120ea Weight: 1,800kg INQUIRY Hanwha DECAN S2 Pick and Place Machine Specifications: Hanwha DECAN S2 Pick and Place Machine Han
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Industry News | 2022-10-13 07:44:15.0
I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
ETA DIP Inverted Camera Online AOI Machine ETA-V5200 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI m
