Industry Directory | Distributor
Stocking distributor featuring adhesives, sealants, encapsulates, coatings, solder, solder chemicals, release agents, dispensing equipment and supplies.
BIRAL SG (AEROSOL SILICONE GREASE) Operates fro -50C to + 200C Supplied in 500ml aerosol cans. -low electrical leakage loss under high humidity conditions -protects against corrosion -safely lubricates all rubber and plastic parts -acts as
Technic Releases TechniPad 7611 New high-performance pure palladium for TechniPad ENEPIG offers a consistent deposit with less maintenance Cranston, RI, USA - Technic has announced the release of TechniPad 7611, an electroless process that deposit
Electronics Forum | Tue Nov 27 19:42:58 EST 2001 | mparker
Dave - will placing MELF's in SMT eliminate the original problem? Is the flux aggressive enough to clean mold release agents from the component manufacturer? Good point about LT reliability, just wondering what would happen if glue was eliminated fr
Electronics Forum | Thu May 20 08:51:29 EDT 2010 | jry74
A lot of our dewetting is happening on plastic body components, such as ICs. When they are manufactured, the molding process requires a mold release to make the part release after molding. Usually, the release agent is silicon based, but you can't
Industry News | 2010-03-27 19:03:08.0
BANNOCKBURN, Ill., USA, - Following a year of active engagement with Congress and Department of Defense (DoD) policy makers, IPC and the IPC PCB Executive Agent Task Force members' are pleased to see their efforts are having a noticeable effect. Two recently released reports from the DoD and the U.S. Commerce Department emphasize the government’s growing awareness of the importance of the U.S. printed circuit board industry in protecting national security.
Industry News | 2018-06-06 20:14:57.0
The U.S. defense industrial base – and the electronics industry in particular – would benefit from a provision in a newly released U.S. Senate bill.
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
The LPKF ZelFlex Z4P is a pneumatic 4-sided high-speed clamping frame for stencils. More information: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/quick-release-frames/zelflex-z4p.htm?utm_source=youtube&utm_medium=social&utm_term=s
Career Center | San Jose, CA, California USA | Engineering,Production,Research and Development
Senior PCB Designer: Want to be part of an exciting pre-IPO enterprise B2B company working on the cutting edge of internet-of-things, artificial intelligence & agents, blockchain, and manufacturing technology? This well-funded venture-backed co
Career Center | , | Engineering,Maintenance,Production
Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma
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. The emergency stop status is released if the door is closed. In order to resume the operation, press ‘READ’ button on the operation panel to release the emergency status, then press ‘Start’ button
| http://www.thebranfordgroup.com/dnn3/Auction/CERI0723.aspx
) Coordinate the removal of those purchased items to meet the time deadlines indicated on this page. 3) Submit an " Agent Release Authorization " form which will allow The Branford Group to release items to a third party contractor for shipping, crating or packing purposes
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