Industry News | 2006-11-08 12:41:46.0
Workshop Scheduled for January 24 in Silicon Valley
Industry News | 2014-08-06 12:33:35.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.
Industry News | 2011-06-16 13:58:56.0
JEDEC Solid State Technology Association announced the publication of JESD84-B45: Embedded MultiMediaCard (e•MMC), Electrical Standard (Version 4.5 Device).
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2014-05-08 12:04:42.0
Saline Lectronics, Inc. announces that it has officially implemented Cogiscan’s Track, Trace and Control (TTC) system.
Industry News | 2022-11-28 07:00:51.0
With the development of the precision and stability of SMT equipment, the manufacturing process and testing links have gradually become the key to the development of the industry. At the same time, the fierce competition in the consumer electronics market has put forward higher requirements for the quality of electronic components. In the production process, it is necessary to use various testing technologies to inspect defects and faults in time and repair them, among these testing technologies, X-ray inspection is one of the most critical process to improve the SMT BGA QFN soldering quality.
Industry News | 2012-08-29 16:15:27.0
Juki Automation Systems, announces that Mega Tech of Oregon (MTO) has begun production with its new KE-1080LN High-Speed Flexible Mounter.
Technical Library | 2013-07-11 15:22:40.0
This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).
Industry News | 2019-03-03 18:54:54.0
PDR today announced the release of Re-Ball Mode Software now available as part of its award-winning ThermoActive Suite Software Package. This latest feature allows the operator to select the software configuration, temperature management and profile management necessary for the successful completion of BGA re-balling operations when using PDR Systems.
Industry News | 2009-09-18 09:45:17.0
MADISON, AL — September 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that it will feature its full range of services in booth 300 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
